Microstructure Evolution And Bond Formation At The Contact Interface During Ultrasonic Consolidation Process

song zhang,lili zheng,hui zhang
DOI: https://doi.org/10.1115/IMECE2014-37203
2015-01-01
Abstract:In this paper a cellular automata-finite elements (CAFE) model is developed by combining traditional finite elements (FE) model and cellular automata (CA) model. The microstructure under different process conditions of ultrasonic consolidation (UC) process for Al 7075 is studied. It is found that higher energy input process conditions (higher applied load and sonotrode oscillation amplitude, lower sonotrode travel speed) will lead to a higher value of dynamic recrystallization (DRX) fraction for UC deposited foils. The mean dislocation density of the UC deposited material will increase with the applied load while it decreases with the increase of sonotrode travel speed and oscillation amplitude.
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