Abstract:In pursuit of high power density and high reliability of power converters, the junction temperature of power devices becomes an essential indicator for heath condition monitoring and thermal management. Particularly under high-temperature operating conditions, the temperature-dependent thermal properties of the chip and ceramic materials must be incorporated to enhance the prediction accuracy. In this article, an improved temperature-dependent Cauer-type thermal network of insulated-gate bipolar transistor (IGBT) module is established. The temperature dependence of thermal parameters for the chip layer and ceramic layer is meticulously considered. More importantly, finite-element method (FEM) simulation is used to yield the heat flux curve of the power module at the center line in order to better imitate the real heat-spreading scenario. In this way, the effective heat transfer area of each layer can be calculated accurately and analytically. By this analytic method, the temperature-dependent thermal impedance can be efficiently determined. Compared with prior-art fully FEM-based temperature-dependent thermal impedance characterization method, the method proposed in this article reduces the FEM simulation time cost approximately 20 times under the same computing hardware facilities and considerably simplifies the parameter extraction process. Finally, experimental results based on two commercial IGBT modules successfully validate the usefulness, effectiveness, and accuracy of the proposed thermal network model.

A 3-D-Lumped Thermal Network Model For Long-Term Load Profiles Analysis In High-Power Igbt Modules

A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules

General 3D lumped thermal model with various boundary conditions for high power IGBT modules

A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-Layer Thermal Coupling and Different Heating/cooling Conditions

Thermal-Fluid Co-Simulation and Modelling of IGBT with Thermal Resistance Network

Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters

An Improved Transient Electro-Thermal Model for Paralleled IGBT Modules

A 3-D Temperature-Dependent Thermal Model of IGBT Modules for Electric Vehicle Application Considering Various Boundary Conditions

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

A 3-D Thermal Network Model for IGBT Modules Considering Temperature Dependence of Heat Dissipation and Thermal Coupling

A Network Topological Approach-Based Transient 3-D Electrothermal Model of Insulated-Gate Bipolar Transistor

Fast and Accurate Temperature Estimation of Three-level IGBT Converter Based on 3-D Coupled Thermal Model

A Transient 3-D Thermal Modeling Method for IGBT Modules Considering Uneven Power Losses and Cooling Conditions

A 3-D Thermal Model Including Thermal Coupling for Insulated Gate Bipolar Transistor Module

Thermal impedance model of high power IGBT modules considering heat coupling effects

A Temperature-Dependent Cauer Model Simulation of IGBT Module with Analytical Thermal Impedance Characterization

A 3D Thermal Network Model for Monitoring Imbalanced Thermal Distribution of Press-Pack IGBT Modules in MMC-HVDC Applications

A Data-Based Igbt Model For Efficient And Accurate Electro-Thermal Analysis

Advanced Electro-Thermal Spice Modelling of Large Power Igbts

FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects