Hyperbranched Polysiloxane (Hbpsi)-Based Polyimide Films with Ultralow Dielectric Permittivity, Desirable Mechanical and Thermal Properties

Xingfeng Lei,Yanhui Chen,Mingtao Qiao,Lidong Tian,Qiuyu Zhang

DOI: https://doi.org/10.1039/c5tc03391h

IF: 6.4

2016-01-01

Journal of Materials Chemistry C

Abstract:A 35 wt% HBPSi polyimide film exhibits an ultralow dielectric permittivity (2.24), accompanied by the most desirable comprehensive properties.

What problem does this paper attempt to address?

Hyperbranched‐polysiloxane‐based Hyperbranched Polyimide Films with Low Dielectric Permittivity and High Mechanical and Thermal Properties

Ruhe Lian,Xingfeng Lei,Yanhui Chen,Qiuyu Zhang

DOI: https://doi.org/10.1002/app.47771

IF: 3

2019-01-01

Journal of Applied Polymer Science

Abstract:ABSTRACTA series of hyperbranched polysiloxane (HBPSi)‐based hyperbranched polyimide (HBPI) films with low dielectric permittivity and multiple branched structures are fabricated by copolymerizing 2,4,6‐triaminopyrimidine (TAP) with 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, 4,4′‐diaminodiphenyl ether, and HBPSi via the two‐step polymerization method. The dielectric permittivity of HBPSi hyperbranched polyimide films decreases with increasing TAP fraction, namely, from 3.28 for sample PI‐1 to 2.80 for PI‐4, mainly owing to the enlarged free volume created by the incorporation of multiple branched structures. Moreover, HBPSi HBPI possesses desirable solubility and good mechanical properties and thermal stability. PI‐4 not only has low dielectric permittivity (2.80, 1 MHz), excellent solubility (soluble in several common organic solvents), and remarkable thermal properties (glass‐transition temperature of 273 °C, 5% weight loss temperature of 498 °C in N2 and 486 °C in O2), but it also demonstrates admirable mechanical properties with a tensile strength of 103 MPa, elongation at break of 7.3%, and a tensile modulus of 2.16 GPa. HBPSi HBPI might have potential applications in interlayer dielectrics and other microelectronics fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47771.
Tunable Permittivity in High-Performance Hyperbranched Polyimide Films by Adjusting Backbone Rigidity

Xingfeng Lei,Mingtao Qiao,Lidong Tian,Yanhui Chen,Qiuyu Zhang

DOI: https://doi.org/10.1021/acs.jpcc.6b09332

2016-01-01

The Journal of Physical Chemistry C

Abstract:Currently, low-dielectric polyimides (PIs) such as fluorinated or porous PIs exhibit a low-dielectric property but have undesirable mechanical and/or thermal properties. Therefore, it is crucial to find a more considerate method that could lower the permittivity, while maintaining or improving the mechanical and thermal properties. Herein, a series of hyperbranched (HB) PI films were synthesized by adjusting the content of the rigid diamine, 2,2'-dimethylbenzidine (DMBZ). The dielectric properties of the HBPIs were accordingly tuned, that is, the permittivity of the resulting HBPIs decreased with increasing the DMBZ fraction owing to the enlarged free volume and the hindered dipole orientations afforded by the rigid DMBZ. The maximum mechanical strength of the resulting HBPIs located at the formulation made using 50% DMBZ and 50% ODA. At this formulation, the optimal comprehensive performances were achieved, that is, excellent tensile strength (124.1 MPa), desirable thermal stability (5% weight loss temperature up to 505 degrees C with weight residual of 56.7% at 800 degrees C under argon), high glass-transition temperature (324 degrees C), low relative permittivity (2.69, 1 MHz), reduced water absorption (similar to 1.86%), and good solubility. Our approach provides a new idea to fabricate low-dielectric PIs with good mechanical and thermal properties.
Space Survivable Polyimides with Excellent Optical Transparency and Self-Healing Properties Derived from Hyperbranched Polysiloxane

Xing F. Lei,Ying Chen,He P. Zhang,Xiang J. Li,Pan Yao,Qiu Y. Zhang

DOI: https://doi.org/10.1021/am402957s

IF: 9.5

2013-01-01

ACS Applied Materials & Interfaces

Abstract:A novel space survivable polyimide with a variety of desirable properties such as excellent thermal stability, high optical transparency, good mechanical strength, satisfactory break elongation, and outstanding atomic oxygen (AO) erosion resistance has been prepared by first synthesizing hyperbranched polysiloxane (HBPSi) and second incorporating HBPSi into polyimide (PI) chains via copolycondensation reactions. The 29Si nuclear magnetic resonance (29Si NMR) spectrum of HBPSi indicated that HBPSi possessed hyperbranched topology. The ground-based simulated AO exposure experiments demonstrated the mass loss of HBPSi polyimides decreased with increasing HBPSi addition and AO fluence, and it reached as low as 7.7% that of pristine polyimide when HBPSi addition was 29.7 wt % after 22 h AO exposure. Surface morphologies confirmed that pristine polyimide was significantly roughened after AO exposure while HBPSi polyimide had even less rough surface topography. During exposure of HBPSi polyimide to AO, the organic polyimide of the surface was first degraded and a silica protective layer eventually formed, which enabled the surface to be "self-healing". It is this passivation layer that prevents the underlying polymer from additional erosion. The whole preparation process of HBPSi polyimide is moderate, low-cost, environmentally friendly, and suitable for industrialized mass production, which contributes this novel material to a "drop-in" replacement for the widely used Kapton on spacecrafts functioning in space environment.
Preparation and Properties of Low Internal Stress Polyimide-b-Polysiloxane with a Hyperbranched Structure

Zhengxiang Zhou,Gebin Shen,Xinrong Huang,Chuanhui Yang,Yingfeng Yu

DOI: https://doi.org/10.1021/acsapm.3c01828

2023-01-01

ACS Applied Polymer Materials

Abstract:Polyimides (PIs) with excellent thermal stability, mechanical toughness, dielectric properties, and an inherently low coefficient of thermal expansion are widely applied in modern microelectronic fields expectedly. However, it is still a challenge to minimize the internal stress between the PI and substrates. Herein, a series of linear and hyperbranched polyimides and polyimide-b-polysiloxane copolymers were fabricated to tailor the modulus and the coefficient of thermal expansion. Their thermomechanical properties, dimensional stabilities, and thermal stabilities were characterized by dynamic mechanical analysis (DMA), thermomechanical analysis (TMA), and thermal gravimetric analysis (TGA), and the phase separation morphology of polyimide-b-polysiloxane was investigated by transmission electron microscopy (TEM) and atomic force microscopy (AFM). The results showed that the internal stress of hyperbranched polyimide decreased by 11.00% compared with linear polyimide, while with the copolymerization of polyimides and polysiloxanes, the internal stress decreased by 54.62%. The hyperbranched polyimide-b-polysiloxane with a lower modulus has a CTE value of 20.1 ppm/degrees C close to the CTE of copper, which has tremendous potential to be applied in chip-scale packaging.
A Novel Phosphorus-Containing Polysiloxane for Fabricating High Performance Electronic Material with Excellent Dielectric and Thermal Properties

Cheng Tang,Hongxia Yan,Manni Li,Qing Lv

DOI: https://doi.org/10.1007/s10854-017-7904-4

2017-01-01

Journal of Materials Science Materials in Electronics

Abstract:A novel 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) functionalized hyperbranched polysiloxane (HBPEp-DOPO) with considerable epoxy groups was synthesized. The structure was characterized by Fourier transform infrared (FTIR) spectra and nuclear magnetic resonance (1H-NMR). HBPEp-DOPO was then introduced into O,O’-diallylbisphenol A/4,4′-bismaleimidodiphenyl methane(DBMI) resin to develop modified composite with excellent dielectric and thermal properties as well as simultaneously improved comprehensive performance. The incorporation of HBPEp-DOPO not only remarkably increased the dielectric, mechanical, and thermal properties, but also obviously improved the flame retardancy. Compared with neat DBMI resin, HBPEp-DOPO/DBMI resins exhibited decreased dielectric loss with increasing the content of HBPEp-DOPO. Besides, adding 10 wt% HBPEp-DOPO could change the UL-94V of DBMI from V-2 to V-0. Moreover, HBPEp-DOPO/DBMI exhibited an improved mechanical property and thermal stability at a small addition amount. These attractive features allows the modified hyperbranched polysiloxane to have broad potential applications in cutting-edge industries, especially in electronic and electric insulating fields.
Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

Yajun Zhang,Jie Wang,Yinjie Chen

DOI: https://doi.org/10.1039/d2ra00267a

IF: 4.036

2022-01-01

RSC Advances

Abstract:A novel high-strength polyimide (PI) nanocomposite film was designed and constructed by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid (PAA). The composite filler (EPPOSS@Gh-BN) was composed of silane coupling agent KH550 modified hexagonal boron nitride (Gh-BN) and epoxidized polyhedral oligomeric silsesquioxanes (EPPOSS), which improved not only the dispersion of the h-BN but also the effective interfacial stress transfer, leading to an enhanced mechanical strength of the resultant PI nanocomposite film of 114 MPa even with a slight EPPOSS@Gh-BN loading of 0.30 wt%, and the storage modulus was increased by more than 30% to 4 GPa compared to pure PI. Meanwhile, the PI/EPPOSS@Gh-BN nanocomposite has better heat transfer performance, higher hydrophobicity, lower dielectric properties, and higher heat stability than pure PI, and is therefore expected to provide an ideal platform for the development of highly flexible electronics in the future.
Hyperbranched Polysiloxane (hbpsi)‐based Colorless Copolyimide Films with Atomic Oxygen (AO) Erosion Resistance

Ruhe Lian,Xingfeng Lei,Guo Xiong,Yuyang Xiao,Qiuyu Zhang

DOI: https://doi.org/10.1002/pol.20220471

IF: 3.046

2022-01-01

Journal of Polymer Science

Abstract:Colorless polyimides (CPIs) with excellent optical transparency and atomic oxygen (AO) erosion resistance have potential applications in optoelectronic devices in low earth orbit (LEO) such as flexible thin film solar cells. Herein, 2-trifluoromethyl-4,4 '-diaminodiphenyl ether (3F-ODA) and amine-terminated HBPSi were synthesized as amino monomers. After co-polymerizing with 1,2,4,5-cyclohexanetetracarboxylic dianhydride (CHDA) and 4,4 '-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) in a typical sequential reaction manner, a series of CPI films with various HBPSi contents were fabricated. The resulting CPIs show high optical transmittance (84.8%-86.8% at 400 nm), outstanding atomic oxygen (AO) erosion resistance (AO erosion rate 4% that of pure CPI), satisfactory mechanical properties (tensile strength ca. 80 MPa, tensile modulus ca. 2.8 GPa), good thermal stability (T-d >= 467 degrees C, T-g >= 304 degrees C) and desirable solubility. More importantly, the resulting CPIs show increasing AO resistance with the increase of HBPSi amount, and a fairly high optical transmittance can still be retained after AO exposure, far better than that of pure CPI. These impressive performances enable HBPSi CPIs capable of being used as substrate for lightweight solar cell arrays onboard spacecraft in LEO environment.
Polyimide Films Based on β-Cyclodextrin Polyrotaxane with Low Dielectric and Excellent Comprehensive Performance

Xuexin Zhang,Yao Dou,Liqun Liu,Meixuan Song,Zhenhao Xi,Yisheng Xu,Weihua Shen,Jie Wang

DOI: https://doi.org/10.3390/polym16070901

IF: 5

2024-03-26

Polymers

Abstract:In order to prepare polyimide (PI) films with a low dielectric constant and excellent comprehensive performance, a two-step method was employed in this study to integrate β-cyclodextrin into a semi-aromatic fluorine-containing polyimide ternary system. By introducing trifluoromethyl groups to reduce the dielectric constant, the dielectric constant was further reduced to 2.55 at 10 MHz. Simultaneously, the film exhibited noteworthy thermal stability (a glass transition temperature exceeding 300 °C) and a high coefficient of thermal expansion. The material also demonstrated outstanding mechanical properties, boasting a strength of 122 MPa and a modulus of 2.2 GPa, along with high optical transparency (transmittance reaching up to 89% at 450 nm). Moreover, the inherent high transparency of colorless polyimide (CPI) combined with good stretchability contributed to the attainment of a low dielectric constant. This strategic approach not only opens up new opportunities for novel electroactive polymers but also holds potential applications in flexible displays, circuit printing, and chip packaging.

polymer science
Enhanced performance of low-dielectric siloxane-polyimide copolymers: Synthesis and properties

Jian Qiao Li,Ming Zeng,Xin Hao Xu,Li Diao,Jia Qi Xie,An Hua Chen,Yu Pei Yang,Ya Peng

DOI: https://doi.org/10.1177/09540083241276779

IF: 1.73

2024-10-16

High Performance Polymers

Abstract:High Performance Polymers, Ahead of Print. Low-dielectric polyimides (PI) films with outstanding overall performance are attractive for next generation microelectronic applications. Herein, a series of two different FPIs and BPIs derived from 4,4′-diaminodiphenyl ether (ODA) and two different functional dianhydrides, 4,4'-(hexafluoroisopropylidene) biphthalic anhydride (6FDA) and 4,4′-(4,4′-isopropyldiphenoxy) biphthalic anhydride (BPADA), respectively, were synthesized by a conventional two-step methodology that included thermoimidatization. Additionally, employing aminopropyl-terminated polydimethylsiloxane PDMS (molecular weight = 1000) as the source of siloxane-oxygen bonds, a series of polyimide siloxane (SiFPIs and SiBPIs) copolymers were synthesized by varying the siloxane content (ranging from 0 to 5 wt%) within the copolymer structure. The effects of siloxane bond on the thermal, solubility, water resistance, dielectric and mechanical properties of polyimide were investigated systematically. The integration of siloxane significantly enhanced the solubility of these copolymers in polar aprotic solvents (DMAC, DMF, NMP), expanding their applicability in diverse processing environments. Crucially, these copolymers exhibited remarkably low dielectric constants—2.90 for SiFPI at 3% PDMS and 2.92 for SiBPI at 4% PDMS—coupled with low loss values, positioning them as prime candidates for advanced microelectronic applications. All the composite films have high thermal stability near pure PI. The introduction of PMDS into PI can improve the elongation at break and at the same time, the composite films still remained with higher modulus and tensile strength. Extensive hydrophobicity assessments through contact angle and water absorption studies underscored the copolymers' superior moisture resistance, a critical parameter for their potential deployment in high-performance, environmentally sensitive electronic components.

polymer science
Toward Maximizing the Mechanical Property of Interconnected Macroporous Polystyrenes Made from High Internal Phase Emulsions.

Song Wang,Jiaxu Li,Mengfei Qi,Xiang Gao,Wen-Jun Wang

DOI: https://doi.org/10.1021/acs.langmuir.7b03176

IF: 3.9

2017-01-01

Langmuir

Abstract:Macroporous materials polymerized from high internal phase emulsions (PolyHIPEs) possess well-defined interconnected porous structures and tunable device shapes. This provides interesting property characteristics well-suited for a variety of applications. However, such materials also demonstrate poor mechanical performances, which limit their potential use. As will be demonstrated, this results from the high surfactant content required by PolyHIPEs. Herein, a new approach is introduced for designing a highly efficient polymeric surfactant, which generates interconnected pores in PolyHIPEs through designing an incompatible surfactant and skeleton material. The surfactant also possesses a hyperbranched topology, which combines the strong amphipathy of small molecular surfactants and the nanosphere structure of Pickering emulsifiers to provide an excellent colloidal stability to HIPEs. A hyperbranched polyethylene having pendant sodium sulfonate groups (HBPE-SO3Na) was thus designed and synthesized via chain walking copolymerization of ethylene and 2-trimethylsilyloxyethyl acrylate followed by sulfonation. Stable HIPEs of styrene/divinylbenzene and water at a weight ratio of 1 to 5 were obtained with using HBPE-SO3Na. The polymerization of HIPEs produced interconnected macroporous polystyrenes (PSs) at a substantially lower surfactant content, for example, 0.5 wt % HBPE-SO3Na. The compressive Young's moduli of PolyHIPEs reached 104-111 MPa with 0.5-2 wt % HBPE-SO3Na, which is the first reported case of a PS-based PolyHIPE achieving its theoretical modulus. The PolyHIPE was used to support Au nanoparticles and embed in a column for oxidation of dimethylphenylsilane. A complete conversion of dimethylphenylsilanol was achieved with low column back pressure in a 50 h continuous reaction with no degradation of PolyHIPE integrity and mechanical property.
Polyimide Foams with Ultralow Dielectric Constants

Hui-Juan Chu,Bao-Ku Zhu,You-Yi Xu

DOI: https://doi.org/10.1002/app.24364

IF: 3

2006-01-01

Journal of Applied Polymer Science

Abstract:To explore ultralow dielectric constant polyimide, the crosslinked polyimide foams (PIFs) were prepared from 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), 4,4'-oxydianiline (ODA), and 2,4,6-triaminopyrimidine (TAP) via a poly(ester-amine salt) (PEAS) process. FTIR measurements indicated that TAP did not yield a negative effect on imidization of PEAS precursors. SEM measurement revealed the homogeneous cell structure. Through using TAP as a crosslinking monomer, the mechanical properties of PIFs could be improved in comparison with uncrosslinked BTDA/ODA based PIF. The crosslinked PIFs still exhibited excellent thermal stability with 5% weight loss temperatures higher than 520 degrees C. In the field with frequency higher than 100 Hz, the dielectric constants of the obtained PIFs ranged from 1.77 to 2.4, and the dielectric losses were smaller than 3 X 10(-2) at 25-150 degrees C. (c) 2006 Wiley Periodicals, Inc.
Low Dielectric and Thermally Stable Hybrid Ternary Composites of Hyperbranched and Linear Polyimides with Sio2

Seongku Kim,Xingyuan Wang,Shinji Ando,Xiaogong Wang

DOI: https://doi.org/10.1039/c4ra02956a

IF: 4.036

2014-01-01

RSC Advances

Abstract:A hydroxyl-terminated hyperbranched polyimide was synthesized via the A2 + B3 reaction between dianhydride and triamine monomers. The hydroxyl groups at the peripheral positions were then introduced by modification of the anhydride end groups via a reaction with 4-aminophenol. Based on the hydroxyl-terminated hyperbranched polyimide, HBPIBPADA-TAP(OH), we successfully fabricated hybrid ternary composites, which were comprised of a linear polyimide (PI6FDA-APB), HBPIBPADA-TAP(OH), and an inorganic SiO2 component. The material was designed to satisfy the requirement for cutting-edge insulators with a low dielectric constant and a high thermal stability. Because of the appropriate choice of the hybrid ternary composite systems with HBPIBPADA-TAP(OH) and inorganic silica, it is sensible to improve the dielectric properties and thermal resistant properties of unary systems or improve the disadvantages of the dielectric and optical properties of binary systems. For an optimized composition, the dielectric constant (Dk) of the PI6FDA-APB–HBPIBPADA-TAP(OH)-30%–SiO2-20% composite reaches the lowest value of 2.24 at 100 kHz. Research also showed that the optical transparency is significantly improved with the increase of the HBPIBPADA-TAP(OH) content in the composite. Compared with the binary linear PI 6FDA-APB–SiO2 composite, the transmittance increases from 1% to 75% at the wavelength of 450 nm. The incorporation of SiO2 can preserve the good thermal properties of the hybrid composites containing HBPIBPADA-TAP(OH). By adding 10% of HBPIBPADA-TAP(OH) to the PI6FDA-APB–SiO2-20% system, the coefficient of thermal expansion of the hybrid ternary composite is 20.9 ppm °C−1 in the temperature range from 100 to 150 °C, which is significantly lower than that of the linear polyimide (37.1 ppm °C−1 for PI6FDA-APB). Because of these optimized properties, hybrid ternary composites have the potential for use in applications in the micro-electronic insulator fields, such as interlayer dielectrics of advanced electronic devices.
Intrinsic Low-Dielectric Cardo Polyimide with High Heat Resistance, High Transparency, and Low Birefringence

Hong Li,Weiyi Jin,Weiyu Zhang,Jie Li,Jiaqi Ji,Yi Tang,Tianqi Yang,Shujiang Zhang,Haixia Yang,Chenliang Gong

DOI: https://doi.org/10.1016/j.giant.2024.100349

2024-01-01

Giant

Abstract:Low-dielectric, transparent, and high-heat-resistant polyimide (PI) films are vital for flexible electronics and high-frequency communication devices. However, balancing these properties within intrinsic polyimides remains a significant challenge. In this work, a nonplanar diamine monomer, 2,7-bis(3,5-bis(trifluoromethyl)phenyl)-9,9-bis(4-nitrophenyl)-9H-fluorene (BTFDA), containing a Cardo structure and four trifluoromethyl groups, was synthesized and copolymerized with commercial monomers to produce a series of polyimides (CPI-X). These CPI-X exhibit exceptional heat resistance, with glass transition temperatures (Tg) exceeding 350°C, decomposition temperatures (Td5%) above 530°C, and low thermal expansion coefficients (CTE < 20.8 ppm/K). Additionally, they have excellent optical properties with over 92% transparency at 450 nm and low birefringence (Δn = 0.00042). They also demonstrate good hydrophobicity with low water absorption (Ma% = 0.04%) and high-water contact angles (Ca = 97.6°). Most importantly, the CPI-X films show excellent dielectric properties (Dk = 2.25, Df = 0.00365 at 1MHz, Dk = 2.13, Df = 0.0065 at 10GHz). Such intrinsic PI films with low Dk values may be ideal candidates for next-generation interlayer media.
Nonfluorinated Copolymerized Polyimide Thin Films with Ultralow Dielectric Constants

Yuan,Bao-Ping Lin,Xue-Qin Zhang,Li-Wei Wu,Yao Zhan

DOI: https://doi.org/10.1002/app.28524

IF: 3

2008-01-01

Journal of Applied Polymer Science

Abstract:A series of copolymerized polyimide (PI) thin films with low dielectric constants were prepared with different molars ratio of bis[3,5-dimethyl-4-(4aminophenoxy)phenyl]methane and 9,9-bis[4-(4-aminophenoxy)phenyl]fluorene as diamines and 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) as a dianhydride. Some films possessed good dielectric properties with an ultralow dielectric constant of 2.3 at 1 MHz. The structures and properties of the thin films were measured with Fourier transform infrared and NMR spectroscopy, thermogravimetric analysis, and dynamic mechanical analysis. The PI films exhibited glass-transition temperatures in the range 223-243 degrees C and possessed initial thermal decomposition temperatures reaching up to 475-486 degrees C in air and 464-477 degrees C in nitrogen. All of the PI films exhibited excellent solubility in organic solvents. The mechanical properties of these films were also examined. (C) 2008 Wiley Periodicals, Inc.
Ultra-low-permittivity, high hydrophobic, and excellent thermally stable fluoroelastomer/polyimide composite films employing dielectric reduction

Xiaodi Dong,Baoquan Wan,Yang Feng,Daomin Min,Ming-Sheng Zheng,Haiping Xu,Zhi-Min Dang,George Chen,Jun-Wei Zha

DOI: https://doi.org/10.1016/j.eurpolymj.2022.111667

IF: 6

2022-12-05

European Polymer Journal

Abstract:Dielectric materials with low permittivity are urgently needed in the field of microelectronics due to the development of integration and miniaturization of integrated circuits. In this work, a series of all-organic polyimide (PI) films with ultra-low-permittivity and high hydrophobicity were successfully synthesized by introducing a kind of fluoroelastomer (FEM). And the significant permittivity reduction phenomenon was discussed through molecular dynamics simulations and practical tests. It was assumed that the hydrogen bond significantly inhibited the dipolar polarization of the FEM/PI composite system, which played an important role in determining the dielectric properties of FEM/PI composite films. At a low filler content of 7 wt%, FEM/PI composites exhibited the optimum permittivity (ε) of 1.21 at 106 Hz, which was the lowest permittivity of the PI films, while a low water absorption of 0.44 % and high thermal stability with a 10 % decomposition temperature (Td10%) of 548 °C were also observed. This simple and effective strategy of fabricating ultra-low-permittivity PI film is a potential way to realize commercial process.

polymer science
Synergistic Enhancement of Mechanical and Dielectric Properties in Transparent Polyimides by Regulating Hydrogen Bonding and Microbranched Cross-Linking Structure

Yulin Li,Jianqiao Zhao,Fen Zhao,Fu Li,Chao Dai,Cheng Chen,Zhilin Yang,Guoli Tu

DOI: https://doi.org/10.1021/acsapm.4c01854

2024-01-01

ACS Applied Polymer Materials

Abstract:The development of polyimide (PI) films with excellent mechanical properties and low dielectric constants is crucial for flexible optoelectronic devices and printed circuit boards. Here, a method to improve the mechanical properties and decrease the dielectric constant of PI films is reported by introducing a synergistic effect between hydrogen bonding (H-bonding) and microbranched cross-linking structures. A triamine monomer (4,4 ',4 ''-(1H-imidazole-2,4,5-triyl) trianiline, DTI) acting as a hydrogen bond donor was designed and synthesized. It was then in situ polymerized with commercial 3,3 ',4,4 '-biphenyl tetracarboxylic dianhydride (BPDA), 4,4 '-(hexafluoroisopropylidene) diphthalic anhydride (6FDA), 4,4 '-oxidianiline (ODA), and 1,4-phenylenediamine (PDA) to obtain four different PI films, BPDA/ODA/DTI, BPDA/PDA/DTI, 6FDA/ODA/DTI, and 6FDA/PDA/DTI. With the introduction of DTI, the corresponding PI films exhibited high modulus and low dielectric constant and coefficient of thermal expansion (CTE). When the DTI content was optimized, several high-performance PI films suitable for electronic applications were achieved. At 10 MHz, the dielectric constant of the 6FDA/PDA series films decreased from 3.39 to 2.89, while the modulus increased from 3.41 to 4.60 GPa. The CTE of the BPDA/PDA series films was reduced from 8.61 to 0.27, a reduction of approximately 97%. Structural characterization, density functional theory (DFT), and molecular dynamics (MD) simulations revealed the synergistic and competitive relationships between hydrogen bonds and branched cross-links within the PI molecular chains. This approach offers a strategy to overcome the performance trade-off in polyimide films.
Emerging ionic liquid-induced porous polyimide films toward ultralow permittivity, improved hydrophobic and electromagnetic wave absorption

Xiaodi Dong,Baoquan Wan,Ming-Sheng Zheng,Haiping Xu,Jiefeng Gao,George Chen,Jun-Wei Zha

DOI: https://doi.org/10.1016/j.polymer.2022.125382

IF: 4.6

2022-11-08

Polymer

Abstract:There is an urgent need for interlayer dielectric materials with ultralow dielectric properties, high temperature resistance and hydrophobicity in the field of microelectronics due to the development of high-density integration and miniaturization of electronic components. Herein, porous polyimide (PI) films were successfully prepared by using ionic liquid (1-Butyl-3-methylimidazolium tetrafluoroborate, [BMIM][BF4]) as porogen for the first time. Based on the inherent good compatibility between [BMIM][[BF4] and polyimide, this ionic liquid could be uniformly dispersed in the PI matrix, thus creating a favorable prerequisite for the formation of pores. It was demonstrated that the optimized rearrangement of PI molecular chains induced by etching process of [BMIM][BF4] led to the generation of pores and the reduction of chain spacing, which endow the porous films excellent dielectric, thermal and mechanical properties. The film with the porosity ratio of 85 vol% exhibited minimum permittivity of 1.5 at a wide range from 102 to 106 Hz, high temperature of 5% weight loss about 532 °C. The porous PI films not only provide the promising ultralow permittivity dielectric materials for the development of modern integrated circuits, but also present potential application in adsorption separation and special electromagnetic detection.

polymer science
Mechanically Strong, Transparent Polyimide Composite Thin Films with a Low Dielectric Constant

He Bai,Yunting Hu,Yongliang Zhao,Xiaomin Zhu,Jianhua Hu,Haitao Wang

DOI: https://doi.org/10.1016/j.coco.2024.102129

IF: 8

2024-01-01

Composites Communications

Abstract:Aromatic polyimide is widely used in microelectronics as dielectric packaging layers. There is a high demand to reduce its dielectric constant to meet the fast development of communication technology. Here we report a simple and eco-friendly approach to preparing polyimide films with a lowered dielectric constant by adding silica hollow nanospheres with an average size of 100 nm in an aqueous solution of poly(amic acid) salt, and subsequent film casting and thermal imidization. The silica hollow nanospheres present a uniform distribution in polyimide matrix after surface modification with 3-aminopropyltriethoxysilane. The dielectric constant of the resulting composite films decreases linearly with particle loading till 15 wt% and reaches the lowest value of 2.5. The surface hardness and elastic modulus of the films improve by adding hollow nanospheres, while maintaining high optical transparency, high flexibility and a low coefficient of thermal expansion.
Siloxane‐containing polyimide films with high heat resistance and low dielectric constant

Song Mo,Lei Zhai,Yi Liu,Gang Han,Yan Jia,Min‐Hui He,Lin Fan

DOI: https://doi.org/10.1049/nde2.12064

2023-11-25

IET Nanodielectrics

Abstract:A series of siloxane‐containing polyimide films were prepared by copolymerising with rigid aromatic dianhydride, siloxane diamines and six different aromatic diamines. The effects of siloxane structures, fluorine and imide content, rigid or soft segment on the heat resistance, moisture absorption, dielectric performance, mechanical and bonding properties were systematically studied. A series of siloxane‐containing polyimide films (PIS) were prepared by copolymerising with rigid aromatic dianhydride, siloxane diamines and six different aromatic diamines. The effects of siloxane structures, fluorine and imide content, rigid or flexible segment on the heat resistance, moisture absorption, dielectric performance, mechanical and bonding properties were systematically studied. The results show that PIS films maintain good heat resistance with Tg between 292 and 420°C and 5% weight loss temperature higher than 500°C. The moisture absorption and dielectric constant can be significantly reduced due to the presence of siloxanes and fluorinated groups, with the absorption rate as low as 1.2% and dielectric constant of 2.85 at 1 MHz. When measured at 10 GHz, the dielectric constant ranges from 3.10 to 3.50, and dielectric loss varies from 0.0059 to 0.0098. The PIS‐6 film has the best comprehensive performance due to the low imide content, introduction of trifluoromethyl and ether bonds. The peeling strength of bonding PIS‐6 film with a copper foil can reach 9.2 N/cm. It is proven that siloxane‐containing PIS films with high heat resistance, low dielectric and outstanding adhesion are achieved, which can be applied for flexible integrated circuit boards, high‐frequency electronics and microelectronics fields.
Perfluorocyclobutyl-containing transparent polyimides with low dielectric constant and low dielectric loss

Weifeng Peng,Huanyu Lei,Luhao Qiu,Feng Bao,Mingjun Huang

DOI: https://doi.org/10.1039/d2py00550f

IF: 4.6

2022-01-01

Polymer Chemistry

Abstract:The combination of loose chain packing and high fluoro content endows PFCB-containing polyimides with excellent optical transparency and dielectric properties. Polymers with low dielectric permittivity and dielectric loss are essential for the microelectrics and wireless communication industries. The perfluorocyclobutyl (PFCB) aryl ether group has been proven to afford polymer materials with a high fluorine content and large free volume, resulting in many attractive properties, e.g. , good thermal and chemical stability, high hydrophobicity, transparency and low dielectric permittivity. Herein, a series of PFCB-containing polyimides were designed and synthesized. The conformational isomers of the diamine monomer could be separated, providing an opportunity to explore the effects of the isomer conformations on the polyimide properties. All these PFCB-containing polyimides present relatively loose chain packings due to their strongly distorted chain conformations. The combined loose chain packing and high fluoro content afford these PFCB-containing polyimides excellent optical transparency and dielectric properties. In particular, dielectric permittivity and dielectric loss values as low as 2.50 and 0.0035 at high frequency (10 GHz) were obtained, enabling potential applications in the microelectronics industry.

polymer science

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