Aes Analysis Of Interdiffusions In Cr/Au, Ti/Au And Tiw/Au Multi-Layer Films

jun he,fang yang,wei wang,li zhang,rui li,dacheng zhang
DOI: https://doi.org/10.1109/edssc.2015.7285204
2015-01-01
Abstract:To predict the reliability of gold electrode, interdiffusions in Cr/Au, Ti/Au and TiW/Au multi-layers when thermally treated were investigated by depth profiling of auger electron spectroscopy (AES). The primitive measuring results suggest that all the under-layer metals diffuse in gold layer when thermally treated and the rise of temperature enhances these diffusions. Cr and Ti accumulate at the surface of gold layer in Cr/Au and Ti/Au samples. And it seems that the introduction of W prevents these accumulations in TiW/Au sample. The measurement of nanohardness indicates that the interdiffusion of under-layer metals increase the nanohardness, while annealing decreases the nanohardness of metal films.
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