Abstract:An electromechanically-coupled micro-contact resistance measurement system is built to mimic the contact process during fatigue testing of nanoscale-thickness interconnects using multiple probe methods. The design combines an optical microscope, high-resolution electronic balance, and micromanipulator-controlled electric probe, and is coupled with electrical measurements to investigate microscale contact physics. Experimental measurements are performed to characterize the contact resistance response of the gold nanocrystalline pad of a 35-nm-thick interconnect under mechanical force applied by a tungsten electrode probe. Location of a stable region for the contact resistance and the critical contact force provides better understanding of micro-contact behavior relative to the effects of the contact force and the nature of the contact surface. Increasing contact temperature leads to reduced contact resistance, softens the pad material, and modifies the contact surface. The stability of both contact resistance and interconnect resistance is studied under increasing contact force. Major fluctuations emerge when the contact force is less than the critical contact force, which shows that temporal contact resistance will affect interconnect resistance measurement accuracy, even when using the four-wire method. This performance is demonstrated experimentally by heating the Au line locally with a laser beam. Finally, the contact resistances are calculated using the LET (Li–Etsion–Talke) model together with combined Holm and Sharvin theory under various contact forces. Good agreement between the results is obtained. This research provides a way to measure change in interconnect line resistance directly under a stable contact resistance regime with a two-wire method that will greatly reduce the experimental costs.

Understanding the Fretting Failure Mechanisms in Gold-Plated Contact Materials

Fretting Behavior of Gold-Plated Contact Materials Used in High-Frequency Vibration and Different Temperature Environment

Research on Fretting Regimes of Gold-Plated Copper Alloy Electrical Contact Material under Different Vibration Amplitude and Frequency Combinations

Fretting Behavior of Au Plated Copper Contacts Induced by High Frequency Vibration

Effects of Current Load on Wear and Fretting Corrosion of Gold-Plated Electrical Contacts

Experimental Research on Fretting Wear Characteristics of Au-Plated Copper Contacts Used in Electrical Connectors

Status of Test Methods for Contact Materials Fretting Wear Characteristics

Effects of Temperature on Fretting Corrosion Behaviors of Gold-Plated Copper Alloy Electrical Contacts

Mechanical behavior and fatigue life estimation on fretting wear for micro-rectangular electrical connector.

Experimental investigation of cold adhesion failure physical mechanism of gold plated contact within the Micro-Electromechanical-Relay

Fretting On Silver-Plated Copper Contact Terminals Of Rectangular Electrical Connector Assemblies

Study of fretting wear mechanisms of complete contacts

Investigation of the Surface Adhesion Phenomena and Mechanism of Gold-Plated Contacts at Superlow Making/Breaking Speed

AC Signal Modulation on Electrical Contacts Due to Vibration Induced Fretting Corrosion

Fretting Wear Behavior and Damage Mechanisms of Inconel X-750 Alloy in Dry Contacts

Effects of Current Load on Wear and Melt Erosion of Electrical Contacts under Fretting Condition

Review of Fretting Wear for Electrical Connector

Finite Element Simulation of Fretting Wear Behaviors under the Ball-on-flat Contact Configuration

Characterization of Micro-Contact Resistance Between A Gold Nanocrystalline Line and A Tungsten Electrode Probe in Interconnect Fatigue Testing

Fretting Wear Behavior and Damage Mechanisms of Inconel X-750 Alloy in Dry Contact Condition

A comparative study on the electrical contact behavior of CuZn40 and AgCu10 alloys under fretting wear: Effect of current load