Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

Growth Behavior of Voids Randomly Distributed at Grain Boundary on Thin Metal Film with Bamboo Microstructures under Thermal Residual Stress Field and Electric Field

Grain Boundary Void Growth in Bamboo Interconnect under Thermal Residual Stress Field

Study on the Growth Behavior of Voids Located at the Grain Boundary

The Evolution of Void Defects in Metallic Films Based on A Nonlocal Phase Field Model

Phase Field Crystal Study of Grain Boundary Structure and Annihilation Mechanism in Low-Angle Grain Boundary

Electromigration-induced Stress in a Confined Bamboo Interconnect with Randomly Distributed Grain Sizes

Constrained Grain Boundary Diffusion in Thin Copper Films

Diffusive crack-grain interplay in freestanding nanocrystalline silver thin film

Emergent grain boundary phases in stressed polycrystalline thin films

Modeling the Interaction Between Vacancies and Grain Boundaries During Ductile Fracture

On the Role of Initial Void Geometry in Plastic Deformation of Metallic Thin Films: A Molecular Dynamics Study

The study of grain boundary density effect on multi-grain thin film under tension

Phase Field Modeling of Grain Boundary Migration and Preferential Grain Growth Driven by Electric Current Stressing

Effects of Free Surface and Heterogeneous Residual Internal Stress on Stress-Driven Grain Growth in Nanocrystalline Metals

Molecular Dynamics Study on the Nano-Void Growth and Coalescence at Grain Boundary

Creep and stress relaxation in free-standing thin metal films controlled by coupled surface and grain boundary diffusion

Structure, Energetics and Kinetics of Metallic Grain Boundary Nano-Voids and Corresponding Discrete Model Studied by Multiscale and Differential Evolution Simulations

A Study of Strain-Driven Nucleation and Extension of Deformed Grain: Phase Field Crystal and Continuum Modeling

Finite Element Study of the Creep Size-Effect in Thin Metal Films

Finite-element simulation of the diffusive growth of grain boundary voids

Influence of grain boundary activites on elastic and plastic deformation of nanocrystalline Cu as studied by phase filed and atomistic simulaiton