Strain Relaxation by Pitting in Aln Thin Films Deposited by Metalorganic Chemical Vapor Deposition

I. Bryan,A. Rice,L. Hussey,Z. Bryan,M. Bobea,S. Mita,J. Xie,R. Kirste,R. Collazo,Z. Sitar
DOI: https://doi.org/10.1063/1.4792694
IF: 4
2013-01-01
Applied Physics Letters
Abstract:Strain relaxation mechanisms were investigated in epitaxial AlN layers deposited on (0001)-oriented AlN substrates by metalorganic chemical vapor deposition. It was revealed that epitaxial AlN layers under tensile strain can exhibit micro-cracks and nano-pits. A correlation existed between the amount of strain and number of pits in localized areas. Pit densities as high as 1010 cm−2 were observed in areas where the tensile strain reached ∼0.4%, while unstrained areas of the film showed step flow growth. These nano-pits occurred as a strain relaxation mechanism and were not related to intrinsic defects, such as threading dislocations or inversion domains.
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