Dynamic Conducting Crack Propagation in Piezoelectric Materials: Mode-II Problem

HaoSen Chen,WeiYi Wei,JinXi Liu,DaiNing Fang
DOI: https://doi.org/10.1007/s11431-015-5795-2
2015-01-01
Science China Technological Sciences
Abstract:This paper studies the dynamic conducting crack propagation in piezoelectric solids under suddenly in-plane shear loading. Based on the integral transform methods and the Wiener-Hopf technique, the resulting mixed boundary value problem is solved. The analytical solutions of the dynamic stress intensity factor and dynamic electric displacement intensity factor for the Mode II case are derived. Furthermore, the numerical results are presented to illustrate the characteristics of the dynamic crack propagation. It is shown that the universal functions for the dynamic stress and electric displacement intensity factors vanish if the crack propagation speed equals the generalized Rayleigh speed. The results indicate that the defined electro-mechanical coupling coefficient is of great importance to the universal functions and stress intensity factor history.
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