Numerical Analysis of Crack Propagation in Piezoelectric Ceramics

D Fang,H Qi,Z Yao

DOI: https://doi.org/10.1046/j.1460-2695.1998.00084.x

IF: 3.373

1998-01-01

Fatigue & Fracture of Engineering Materials & Structures

Abstract:The formulation of an isoparametric displacement – electric potential finite element method that accounts for the electro‐mechanical coupling effect of piezoelectric materials is briefly presented in this paper. The crack propagation behaviour and the elasto‐electric fields near a crack tip in a PZT‐5 piezoelectric ceramic under mechanical, electrical and mechanical – electrical mixed loads are investigated using this electro‐mechanical finite element method. From the numerical results, it can be seen that crack propagation along the crack plane direction will be impeded and the crack will tend to propagate at an angle of about 84° to the crack plane under a negative electric field on the basis of the maximum stress criterion. The physical explanation of the phenomena is presented in this paper and it is shown that the mechanical strain energy release rate is not a good criterion for predicting crack propagation in the case where the ratio of the electric field to the mechanical load becomes large.