Abstract:This article is devoted to the synergistic design of the thermal management and signal integrity for 3-D integrated chips. The structure parameters of the micro-fin and interconnected components are optimized to obtain a balanced performance of chip heat dissipation and signal integrity. The 3-D integrated chip flows heat transfer model under the action of electrothermal coupling is developed. A full-wave electromagnetic simulation model of the signal interconnection components is proposed with the same structural parameters. The effects of various structural factors on the heat transfer performance and signal integrity of 3-D integrated chips are investigated. A multiobjective optimization algorithm is carried out to simultaneously reduce the total thermal resistance of the 3-D integrated chip and the signal transmission losses of the critical interconnect components. The results show that the total thermal resistance of the 3-D IC becomes lower with a larger through-silicon via (TSV) diameter, micro-fins height and micro-fin radius, and smaller oxide thickness. When the TSV diameter and oxide thickness increase, the height and radius of the micro-fins are reduced to facilitate the signal transmission of the chip’s interconnected components. The response surface analysis method was used to design the experimental combination and thus obtain the fit function for the performance of the two objectives. Hundred sets of Pareto optimal solutions are obtained by multiobjective optimization. The technique for order preference by similarity to ideal solution (TOPSIS) method is used to select the weights of the two optimization objectives to determine the optimal solution. When thermal resistance and signal transmission are given equal weight in the chip design, thermal resistance is reduced by 13.8%, and signal transmission efficiency is improved by 9.74%. The study has important implications for chip thermal management and signal integrity.

A Preliminary Experimental Validation of Superposition Strategy in Thermal Management of Integrated Circuit with Multiple Hot-Spots

A Low Computational Cost and Accurate Thermal Calculation Method for Multi-hotspot IC

Comprehensive Thermal Resistance Model of Forced Air Cooling System for Multiple Power Chips

System-Level Analysis of 3D ICs with Thermal TSVs

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

Coupling management optimization of temperature and thermal stress inside 3D-IC with multi-cores and various power density

Machine Learning for 3D-IC Electric-Thermal Simulation and Management

A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC

Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic

From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0

Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits

Physical Modeling And Simulation Of Thermal Heating In Vertical Integrated Circuits

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Self-heating effects in integrated circuits with hot spot method and electro-thermal coupling method

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

Study on Self-Heat Effects in Integrated Circuits with Hot-Spot and Electro-Thermal Coupling Methods

Multi-Objective Optimization for Heat Transfer Performance of Micro-Fins and Signal Integrity of Key Interconnect Technologies in 3d Integrated Chips

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

A layout-to-simulation approach for thermal design of IC