Abstract:Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. The eutectic Sn-Pb alloy has been widely used in surface mount technology (SMT) for the interconnection and mechanical support between electronic components and printed circuit boards (PCB). During the last decades, there have been strong worldwide environmental movements towards "green" non-toxic electronic products. Initiatives and legislation forced the electronics industry to replace lead containing products with more environmental friendly, lead free products. Sn-Zn solder system is therefore a promising candidate, recommended for its low melting temperature, around 200°C, which is close to the melting temperature of the traditional binary tin lead solder. But the low cycle fatigue data of Sn-Zn solder system has not been reported yet and the lack of reliability data is one of the barriers to the application of the Sn-Zn system solder alloy. The aim of the present work is to investigate the low cycle fatigue behaviour of the lead-free Sn-8Zn-3Bi solder joint using lap shear test samples. Finite element simulation is presented and the Coffin-Mason equation for Sn-8Zn-3Bi solder joint is given based on the experimental and simulation results: Nf = 0.0294 ()-2.833 Where the Nf is the number of cycles to failure and  is the plastic shear strain. Another important issue, related to reliability of solder joints that has been investigated in this work, is the intermetallic compounds (IMCs). Generally, the interconnection by the solder joint is completed by the formation of IMCs at the interface and the reliability of the whole package is affected by IMCs due to their inherent brittle nature and tendency to generate structural defects. The interfacial reaction of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on Au/electroless Ni metallization after high temperature storage (HTS) testing at 150°C is investigated for the reliability of electronic production from the metallurgical viewpoint in this work. It is noticed that Ni3Sn4 intermetallic compounds (IMCs) are found in the Sn-Ag system, while two kind of interfacial productions that are (Ni,Cu)3Sn4 IMC layer and (Cu,Ni)6Sn5 spalling compound gains exists in the Sn-Ag-Cu system. Kirkendall voids are found in both lead free solder joints and clear gap exists at the interface for the case of Sn-Ag solder joint after 1000 hour aging.

Effects of Load and Thermal Conditions on Pb-Free Solder Joint Reliability

Mechanical Properties and Parameter Determination of Anand Viscoplastic Constitutive Model for Pb-free Solder Alloys

Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

Properties and Reliability of Sn-Pb and Lead-Free Mixed Soldering

Reliability issues of lead-free solder joints in electronic devices

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Study on Lead-Free Solder Joint Reliability Based on Grain Orientation

Mechanical Properties and Evolution Behaviors of Different Sn63Pb37 Solders Under Reliability Test

Effects of Nitrogen on Wettability and Reliability of Lead-Free Solder in Reflow Soldering

Effect of Refl owing Atmosphere on Mechanical Properties of Sn-3.0Ag-0.5Cu Pb-free Solder Joints

Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests

Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability

Drop Performance Research of Silver Content on the SnAgCu Based Lead-Free Solder of Joint Level

Thermal Fatigue Process of Novel Sn-Zn System Lead-Free Solder Joint

The impact of thermal cycling regime on the shear strength of lead‐free solder joints

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Effects of Package Geometry on Thermal Fatigue Life and Microstructure of Sn–Ag–Cu Solder Joint

Influence Of The Solder Volume And Reflow Process On Solderability Of The Aluminum Solder Paste And Reliability Of Sn-0.3ag-0.7cu/6061al Solder Joints In Packages Of Led Lighting Components And Structures

Experimental Tests and Stress Analysis of SnPb Solder Joints in a Ceramic PoP Device

Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics