Abstract:The demands for high density, fine pitch interconnections in electronics systems has seen solder-based approaches for such interconnections miniaturized to the scale of tens of micro meters. At such a small scale, such 'micro joints' may contain only one or a few grains and the resultant mechanical behaviour may not be that for a polycrystalline aggregate, but rather for a single crystal. Since the ~-Sn matrix of SnAgCu solder has a contracted body-centred tetragonal (BCT) structure, such a solder grain is expected to demonstrate a considerably anisotropic behaviour. In such cases the reliability of a Phfree solder is strongly dependent on the local microstructural features, such as the size and orientation of the grains. This thesis presents the investigation of the evolution of microstructure within a joint or at the interface and, the influence of such microstructural features on the meso-scale mechanical behaviour of the Ph-free solder. It includes Evolution of the interface between a molten solder and the Cu substrate To form a joint, the solder alloy is heated and molten, wetting a solid under-bump metallization. After solidification, layers of brittle intermetallic compounds (IMCs) are formed at the interface. In this project, facilities were set up to obtain interfacial reactants at an arbitrary moment of the liquid/solid reaction. Formation and evolution ~ during reflow of SnCu IMCs at the interface between the molten SnAgCu alloy and the Cu UBM was captured and presented for the first time. Formation of phases and IMCs with the body of a liquid SnAgCu solder during solidification The formation behaviour of basic components for a SnAgCu grain (including Sn dendrites, AIDSn and Cu6Sns IMCs) during solidification was investigated. Relationships between the growth behaviour of these components and their internal lattice orientation were studied. The characteristic growth and coupling of AIDSn IMCs and the Sn matrix to form eutectics has been elaborated and presented in this study for - 1- the first time. Based on the results, the forming process of a eutectic SnAgCu grain under the non-equilibrioum solidification condition was illustrated; and major factors that determine the lattice-orientation, size and substructure of the grain were discussed. Meso- and Micro- scale mechanical behaviour of a SnAgCu solder joint To study the size effect on the microstructure, and subsequently, the meso-scale · mechanical behaviour, solder joints were manufactured with varying geometries. Shearing tests were performed·on these meso-scale joints. The results first demonstrated that the anisotropic characteristics of a SnAgCu grain play an important role in the mechanical behaviour of both a meso-scale solder joint and the adjacent interfacial IMCs. To further investigate the micro-scale deformation and damage mechanisms, micro-mechanical tests were preformed within a SnAgCu grain. Constitutive equations for a SnAgCu grain Based on the experimental results, a crystal model was established to describe the local microstructure-dependent mechanical behaviour. The constitutive equation was implemented by means of the finite element approach, and applied in solder joints of a Flip Chip (FC) package by a multi-scale method. To describe the crystal behaviour at the higher temperature, the model was improved to account for deformations due to vacancy diffusion and thermal expansion. This model was integrated by an implicit approach, and implemented in a full three dimension (3D) finite element (FE) model.

Study on Lead-Free Solder Joint Reliability Based on Grain Orientation

Role of Grain Orientation in the Failure of Sn-Based Solder Joints under Thermomechanical Fatigue

Mechanical Properties and Parameter Determination of Anand Viscoplastic Constitutive Model for Pb-free Solder Alloys

Effect of Grain Orientation on Electromigration Degradation in Lead-Free Solder Joints

Grain Orientation Evolution and Deformation Behaviors in Pb-Free Solder Interconnects Under Mechanical Stresses

Study of the effect of crystal orientation on the mechanical response and fatigue life of solder joints under thermal cycling by crystal plasticity

The In-Situ Observation of Microstructure, Grain Orientation Evolution and Its Effect on Crack Propagation Path in SAC305 under Extreme Temperature Changes

Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints

Microstructural Features and Mechanical Behaviour of Lead Free Solders for Microelectronic Packaging

Effect of Grain Orientation on Mechanical Properties and Thermomechanical Response of Sn-Based Solder Interconnects

Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

A method to determine the slip systems in BGA lead-free solder joints during thermal fatigue

Investigating the preferential growth of Bi grains in Sn-Bi based solder under thermal aging

The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

Study on Electromigration Mechanism of Lead-Free Sn3.5Ag0.5Bi8.0In Solder Joints

Localized recrystallization and cracking behavior of lead-free solder interconnections under thermal cycling

Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability

Analysis of Cu6sn5 Grain Orientations in Sn3.0ag0.5cu Lead-Free Solder Joints

Thermal Creep and Fracture Behaviors of the Lead-Free Sn–Ag–Cu–Bi Solder Interconnections under Different Stress Levels

Plastic Strain Distribution As a Precursor for Transition from Ductile to Brittle Failure in Lead-Free Solder Joints

Geometry Effect on Mechanical Performance and Fracture Behavior of Micro-Scale Ball Grid Array Structure Cu/Sn-3.0ag-0.5cu/Cu Solder Joints