A 28 GHz Compact Substrate Integrated Wave-guide Bandpass Filter with Defected Ground Structure Using TGV Technology
Lingyue Wang,Hongwei Chen,Wenlei Li,Jihua Zhang,Libin Gao,Xingzhou Cai,Zhen Fang,Yong Li,Yong Zhu,Rui Zhang
DOI: https://doi.org/10.1109/tcpmt.2023.3333410
2023-01-01
Abstract:This article presents a bandpass filter (BPF) based on substrate-integrated waveguide (SIW) using modified through glass vias (TGVs) technology. Optimized TGV technology realizes fine feature size, proper via sidewall shape, and good via surface profile, which accommodates SIW design rules in millimeter-wave (mmWave) band and precisely actualizes the SIW structure. In addition, a novel defected ground structure (DGS) loading half-mode SIW (HMSIW)-DGS unit is proposed to miniaturize the BPF. The proposed DGS unit efficiently exploits the available area on the top metal layer of the HMSIW structure to increase the equivalent capacitance and inductance of the guided wave structure. Compared with the conventional DGS units, it actualizes a smaller size at the same bandgap frequency. To prove the validity, the mmWave BPF with three cascaded HMSIW-DGS units is constructed and designed at 28 GHz. The proposed BPF is numerically optimized and experimentally verified, and the simulation results are in good agreement with the measured results. The measured results indicate insertion loss (IL) of 1.12 dB, 3-dB fractional bandwidth (FBW) of 27.7%, and electrical dimensions of $0.37\lambda _{0} \times 0.12\lambda _{0}$ . In comparison with the existing designs, the proposed BPF shows the superior advantages of small size, low IL, and advanced process flow.