Enhancement of Dielectric Strength and Processibility of High Dielectric Constant Al Nanocomposite by Organic Molecule Treatment

Zhuo Li,Kyoung Sik Moon,Saewon Kim,C. P. Wong

DOI: https://doi.org/10.1109/ectc.2011.5898803

2011-01-01

Abstract:Processible high-dielectric (high K) and low loss materials are in great and urgent demand for power module packaging of next generation low power integrated heterogeneous systems, where efforts to migrate current bulky AC-DC converting systems to 2D/3D high density integrated systems will be intensively made.We had demonstrated very high K composites (over 150) with low loss, where a core-shell structure (Al2O3 passivation shell and Al core) of aluminum particles plays a critical role for the permittivity. The composite showed high adhesion onto the organic substrates and copper surfaces. However, one challenging issue on the core-shell Al composite is the low dielectric strength (breakdown voltage), which limits its use in high power applications. The low breakdown voltage is attributed to the dielectrically weak surface of the Al particles. The thin Al2O3 shell with a thickness in the order of tens of nanometers limits its dielectric strength.This study focuses on surface modification of the core-shell Al nanoparticles with organic molecules that can provide not only the high dielectric strength but also improved dispersion and processibility in epoxy resins. We found that the epoxy nanocomposite filled with organic molecules-treated core-shell Al particles shows a dramatic improvement in dielectric breakdown and dispersion.Effects of the different coating molecules on the breakdown voltage and dielectric properties were studied. The mechanism of the interface chemical treatment was discussed. In addition to the enhanced dielectric strength, the improved flowability and processibility of the high filler loaded compound by the surface modification and using a bimodal particle size are presented.