Non-destructive Testing for Defects in Electronic Package Based on Infrared Thermography

Liu Chengyan,Qin Fei,Ban Zhaowei
DOI: https://doi.org/10.1109/icept.2013.6756600
2013-01-01
Abstract:Defects such as interfacial delaminations degrade the yield rate and reliability of the device. It's important to find and evaluate these defects on time. Infrared Thermography is proved to be a valuable tool for non-destructive testing of materials. In this paper the relationship between the thermal characteristics of the sample surface and the defect feature parameters is investigated using Infrared Thermography; while an approach to quantitatively evaluate the defect is proposed.
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