Pursuit of Future Interconnect Technology with Aligned Carbon Nanotube Arrays [Nanopackaging]

Yang Chai,Minghui Sun,Zhiyong Xiao,Yuan Li,Min Zhang,Philip C. H. Chan
DOI: https://doi.org/10.1109/mnano.2010.939831
2011-01-01
IEEE Nanotechnology Magazine
Abstract:As the feature size of interconnect technology continues to scale down to nanometer sizes, the state-of-the-art Cu interconnect is expected to run into its physical limit in the near future. Carrier scattering at surfaces and grain boundaries leads to a dramatic increase of Cu resistivity at the nanoscale, resulting increasing resistance capacitance signal delay. The Cu interconnect is becoming mo...
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