Abstract:Gate oxide breakdown (OBD) is a key factor limiting the useful lifetime of an integrated circuit. Unfortunately, the conventional approach for full chip OBD reliability analysis assumes a uniform oxide thickness and worst-case temperature for all devices. In practice, however, gate oxide thickness varies from die-to-die and within-die and hence may cause different reliability for different devices even chips. Moreover, due to the increased across-die temperature variation, such difference may be exacerbated. Thus, as the precision of variation control worsens, an alternative reliability analysis approach is needed. In this paper, we propose a statistical framework for chip-level gate OBD reliability analysis while considering both die-to-die and within-die components of thickness variations as well as the across-die temperature variation. The thickness of each device is modeled as a distinct random variable and thus the full chip reliability estimation problem is defined on a huge sample space of several million devices. We observe that the chip-level OBD reliability function is independent of the relative location of the individual devices. This enables us to transform the problem such that the resulting representation can be expressed in terms of much fewer random variables. Using this transformation, we present a computationally efficient and accurate approach for estimating the full chip reliability while considering spatial correlations of gate oxide thickness as well as temperature variation. We show that, compared to Monte Carlo simulation, the proposed method incurs an error of only around 1% while improving the runtime by more than three orders of magnitude.

Variation and Reliability in FPGAs

Process Variation and Temperature-Aware Full Chip Oxide Breakdown Reliability Analysis.

Process Variation and Temperature-Aware Reliability Management

Reliability-Aware Overlay Architectures for FPGAs: Features and Design Challenges

Reliability- and Process Variation-Aware Placement for FPGAs

A Statistical Framework for Post-Fabrication Oxide Breakdown Reliability Prediction and Management

Post-fabrication measurement-driven oxide breakdown reliability prediction and management.

Design and FPGA Verification of a Novel Reliable Real-Time Data Transfer System

Variability- and Reliability-Aware Design for 16/14nm and Beyond Technology

Statistical Timing and Power Optimization of Architecture and Device for FPGAs

The Research of FPGA Reliability Based on Redundancy Methods

A statistical approach for full-chip gate-oxide reliability analysis

Reliability Modeling of Fault-Tolerant FPGA-Based Architectures in Space Applications for Soft and Hard Error Recovery

Reliability variability simulation methodology for IC design: An EDA perspective

A survey on Dependable Digital Systems using FPGAs: Current Methods and Challenges

Fault-tolerant Technology of SRAM-based FPGA

Improving Reliability, Security, and Efficiency of Reconfigurable Hardware Systems

FPGA Power and Timing Optimization: Architecture, Process, and CAD

Fault modeling and characteristics of SRAM-based FPGAs (abstract only).

Testing and Diagnosis for Both Interconnect Resources and CLBs in Virtex Series FPGAs

FPGA Architecture: Principles and Progression