Recent development of temperature compensated SAW Devices

kenya hashimoto,michio kadota,takeshi nakao,masanori ueda,michio miura,hiroyuki nakamura,hidekazu nakanishi,kenji suzuki
DOI: https://doi.org/10.1109/ULTSYM.2011.0021
2011-01-01
Abstract:This paper reviews recent progress of temperature compensated surface acoustic wave (SAW) devices for wireless communications. First, temperature compensation techniques based on the SiO2 deposition and the wafer bonding are explained, and their implementation into real devices are discussed. Finally, we will show how high performances have been realized by the use of these technologies.
What problem does this paper attempt to address?