Mechanical Behaviour of Grains in SnAgCu Solder Joints

Jicheng Gong,Changqing Liu,Paul P. Conway,Vadim V. Silberschmidt

DOI: https://doi.org/10.1109/emap.2006.4430595

2006-01-01

Abstract:A collection of slides from the authors conference presentation is given.

What problem does this paper attempt to address?

Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints

jicheng gong,changqing liu,paul p conway,vadim v silberschmidt

DOI: https://doi.org/10.1109/ectc.2006.1645655

2006-01-01

Abstract:SnAgCu alloy, which promises compatible properties with Sn-Pb solder, has been identified as one of the most potential Lead-free solders for electronic interconnections. However, due to the miniaturization of solder joints, a micro-joint of this material contains only few grains. In this case, the mechanical behaviour of solder alloys shifts from the polycrystal-based to single-crystal based. Since beta-Sn, the matrix of SnAgCu solder, has a contracted body-centred tetragonal structure, its grains is expected to have anisotropic properties, which are important the reliability of a micro-joint. The present paper studies the inelastic anisotropic behaviour of this material. In order to analyse the effect of grain features, solder joints at different size are formed under the different cooling rate. An In-situ shear test is then performed to correlate the mechanical behavior of a joint to its microstructural features. The results show that the decrease in the joint's dimension results in the diminishment of the number of grains, and that the inelastic behaviour of SnAgCu grains is orientation-dependent.
Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Kun Liang,Yuexing Wang,Zhigang He

DOI: https://doi.org/10.3390/ma15072455

IF: 3.4

2022-03-26

Materials

Abstract:Ball shear testing is an efficient approach to investigate the mechanical reliability of solder joints at the structural level. In the present study, a series of low-speed ball shear tests were conducted to study the deformation and fracture characteristics of Sn96.5Ag3Cu0.5 solder joints at continuous speeds from 10 μm/s to 200 μm/s. In order to account for randomness, the quantity of tests was repeated for each shear rate. The relationship between mechanical properties and shear speeds was calculated in detail via effective statistical analysis. In addition, by utilizing SEM imaging and ingredient analysis the interfacial effect and fracture mechanism of solder balls were obtained and their fracture mode classified into two types, viz., bulk fracture and interface fracture. Furthermore, by means of statistical analysis and approximate calculation it was proven that bulk fracture balls have greater adhesive powers and reliability compared with interface fracture balls.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate

Jicheng Gong,Changqing Liu,Paul P. Conway,Vadim V. Silberschmidt

DOI: https://doi.org/10.1109/ectc.2007.373869

2007-01-01

Abstract:With the continuing increase of the integration density in electronics, dimensions of interconnections for electronic components have been miniaturized to a scale that is comparable to those of their crystallographic structure. For instance, a SnAgCu solder joint in the flip chip package can contain only one or a few grains. In this case, the mechanical behaviour of the micro-joint is expected to shift from a polycrystalline-based to single-crystal one. Considering the further miniaturization, both the crystallographic structure and mechanics of each component (Ag3Sn, Cu6Sn5 and beta-Sn matrix) within a grain and the adjacent SnCu interface will play an important role in the reliability of the micro-joint due to their size comparable with that of a grain, irregular geometry, their heterogeneous distribution and considerably different properties. In addition, at such a small scale, the non-local effect on deformation of beta-Sn should be taken into account to interpret mechanical interactions between components. In this paper, a shearing test, in which it is possible to apply a constant loading to a SnAgCu joint is deigned to investigate mechanics of substructure within a SnAgCu grain and near the SnCu interface.
Microstructural Features and Mechanical Behaviour of Lead Free Solders for Microelectronic Packaging

Jicheng Gong

2007-01-01

Abstract:The demands for high density, fine pitch interconnections in electronics systems has seen solder-based approaches for such interconnections miniaturized to the scale of tens of micro meters. At such a small scale, such 'micro joints' may contain only one or a few grains and the resultant mechanical behaviour may not be that for a polycrystalline aggregate, but rather for a single crystal. Since the ~-Sn matrix of SnAgCu solder has a contracted body-centred tetragonal (BCT) structure, such a solder grain is expected to demonstrate a considerably anisotropic behaviour. In such cases the reliability of a Phfree solder is strongly dependent on the local microstructural features, such as the size and orientation of the grains. This thesis presents the investigation of the evolution of microstructure within a joint or at the interface and, the influence of such microstructural features on the meso-scale mechanical behaviour of the Ph-free solder. It includes Evolution of the interface between a molten solder and the Cu substrate To form a joint, the solder alloy is heated and molten, wetting a solid under-bump metallization. After solidification, layers of brittle intermetallic compounds (IMCs) are formed at the interface. In this project, facilities were set up to obtain interfacial reactants at an arbitrary moment of the liquid/solid reaction. Formation and evolution ~ during reflow of SnCu IMCs at the interface between the molten SnAgCu alloy and the Cu UBM was captured and presented for the first time. Formation of phases and IMCs with the body of a liquid SnAgCu solder during solidification The formation behaviour of basic components for a SnAgCu grain (including Sn dendrites, AIDSn and Cu6Sns IMCs) during solidification was investigated. Relationships between the growth behaviour of these components and their internal lattice orientation were studied. The characteristic growth and coupling of AIDSn IMCs and the Sn matrix to form eutectics has been elaborated and presented in this study for - 1- the first time. Based on the results, the forming process of a eutectic SnAgCu grain under the non-equilibrioum solidification condition was illustrated; and major factors that determine the lattice-orientation, size and substructure of the grain were discussed. Meso- and Micro- scale mechanical behaviour of a SnAgCu solder joint To study the size effect on the microstructure, and subsequently, the meso-scale · mechanical behaviour, solder joints were manufactured with varying geometries. Shearing tests were performed·on these meso-scale joints. The results first demonstrated that the anisotropic characteristics of a SnAgCu grain play an important role in the mechanical behaviour of both a meso-scale solder joint and the adjacent interfacial IMCs. To further investigate the micro-scale deformation and damage mechanisms, micro-mechanical tests were preformed within a SnAgCu grain. Constitutive equations for a SnAgCu grain Based on the experimental results, a crystal model was established to describe the local microstructure-dependent mechanical behaviour. The constitutive equation was implemented by means of the finite element approach, and applied in solder joints of a Flip Chip (FC) package by a multi-scale method. To describe the crystal behaviour at the higher temperature, the model was improved to account for deformations due to vacancy diffusion and thermal expansion. This model was integrated by an implicit approach, and implemented in a full three dimension (3D) finite element (FE) model.
Mesomechanical modelling of SnAgCu solder joints in flip chip

Jicheng Gong,Changqing Liu,Paul P. Conway,Vadim V. Silberschmidt

DOI: https://doi.org/10.1016/j.commatsci.2007.07.039

IF: 3.572

2008-01-01

Computational Materials Science

Abstract:In modern microelectronic packages (considered here as a mesoscale), the size of microstructural features of an alloy is compatible with the scale of an entire element that can contain only one or a few grains. In this case, the mechanical behaviour of the element deviates from isotropic/homogenous character at the macroscopic scale of a bulk specimen, comprising a large number of randomly oriented grains. Generally, a crystal-plasticity model, which is based on dislocation sliding in certain slip systems, is applied to describe a local lattice-induced anisotropic behaviour. However, even at a room temperature, the movement of dislocations is not a single mechanism of the inelastic behaviour of eutectic SnAgCu solder due to its low melting point. Under a low-magnitude loading condition, creep also has an effect due to a movement of vacancies. At high temperatures, this creep can become a dominant mechanism for the inelastic behaviour, diminishing the role of the crystal-plasticity model. This paper accounts for the creep component of deformation and unites it with the traditional crystal-plasticity model. In addition, deformation due to thermal expansion is introduced into the constitutive equation to capture the major mechanisms of the mechanical behaviour of a SnAgCu solder micro-joint used in electronics.
Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

Jicheng Gong,Changqing Liu,Paul P. Conway,Vadim V. Silberschmidt

DOI: https://doi.org/10.1016/j.commatsci.2006.02.020

IF: 3.572

2007-01-01

Computational Materials Science

Abstract:Miniaturisation of SnAgCu solder joints for electronic package results in the diminishment of the number of grains within a single joint, sometimes down to only one or two grains per joint. In this case, solder joints exhibit an anisotropic creep behaviour. Moreover, the crystal structure of β Sn (matrix of SnAgCu eutectics and Sn dendrites) is a contracted version of a diamond cubic, one leading to a body-centred tetragonal structure, which enhances this non-uniform character. These factors affect the character of creep and consequently determine reliability of solder joints for electronic packages. In this study, a crystal visco-plasticity model is developed to capture an anisotropic behaviour of SnAgCu solder joints in cases of single-, bi- and multi-crystals. In order to simulate responses of solder joints under thermal cycling, a multi-scale finite element modelling is performed. In a global model, responses of joints in a flip chip package are simulated. Then results for displacements are adopted in the sub-model of a single joint. The obtained results are compared with those based on the traditional isotropic constitutive descriptions.
Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

Jicheng Gong,Paul P. Conway,Changqing Liu,Vadim V. Silberschmidt

DOI: https://doi.org/10.1007/s11664-009-0871-7

IF: 2.1

2009-01-01

Journal of Electronic Materials

Abstract:To study the intragranular mechanical behavior of a Sn-Ag-Cu solder, a focused ion beam system was used to manufacture a notched microspecimen at a eutectic area within a grain. A low-speed tensile test was performed on the microspecimen using an Instron 5848 microtester at room temperature. The results show that, besides an obvious shearing deformation, a large number of subgrains are formed in the β-Sn matrix. Subgrain boundaries are composed of a large number of dislocations. Besides the heterogeneous deformation due to the notch, Ag 3 Sn intermetallic compounds influence the evolution path of subgrain boundaries.
Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints

Aniket Bharamgonda,Idowu Olatunji,Xiao Lin,Abhijit Dasgupta,Yaxiong Chen,Varun Thukral,Torsten Hauck

DOI: https://doi.org/10.1109/eurosime60745.2024.10491536

2024-01-01

Abstract:SnAgCu solder joint has oligocrystalline (few large grains) structure and due to body-centered tetragonal (BCT) structure, each grain shows strongly anisotropic behavior. Modelling anisotropic behavior of grain scale solder joints has been extensively researched by this group. In this paper, anisotropic grain-scale plasticity model is used to predict variability of solder joint fatigue durability under sine sweep vibration excitation. Solder experiences different levels of cyclic stress for different grain orientations. Stress-based high cycle fatigue (HCF) model (Basquin’s model) and Miner’s rule are used for determining the variability of vibration durability of solder joints for different orientations and compared with experimental results.
Formation of Sn Dendrites and SnAg Eutectics in a SnAgCu Solder

Jicheng Gong,Changqing Liu,Paul P. Conway,Vadim V. Silberschmidt

DOI: https://doi.org/10.1016/j.scriptamat.2009.05.034

IF: 6.302

2009-01-01

Scripta Materialia

Abstract:The formation behaviour of grains and their components, including Sn dendrites, Cu(6)Sn(5) and Ag(3)Sn intermetallic compounds (IMCs), in a SnAgCu alloy is investigated in an experiment in which it was possible to obtain the solid reactants directly from the liquid solder during the liquid-solid phase transformation. The results show that Cu(6)Sn(5) IMCs are formed first in a grain; then large Sn dendrites; fibre-like Ag(3)Sn IMCs are formed ahead of the beta-Sn matrix in the coupling process, generating eutectics. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Effect of Grain Orientation on Mechanical Properties and Thermomechanical Response of Sn-Based Solder Interconnects

Hongtao Chen,Bingbing Yan,Ming Yang,Xin Ma,Mingyu Li

DOI: https://doi.org/10.1016/j.matchar.2013.07.004

IF: 4.537

2013-01-01

Materials Characterization

Abstract:The thermomechanical response of Sn-based solder interconnects with differently oriented grains was investigated by electron backscattered diffraction technique under thermal cycling and thermal shock testing in this study. The results showed that deformation and cracking of solder interconnects have a close relationship with the unique characteristics of grain orientation and boundaries in each solder interconnect, and deformation was frequently confined within the high-angle grain boundaries. The micro Vickers hardness testing results showed that the hardness varied significantly depending on the grain orientation and structure, and deformation twins can be induced around the indents by the indentation testing.
Morphologies and grain orientations of CuSn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Wei Liu,Yanhong Tian,Chunqing Wang,Xuelin Wang,Ruiyang Liu

DOI: https://doi.org/10.1016/j.matlet.2012.07.016

IF: 3

2012-01-01

Materials Letters

Abstract:Morphologies and grain orientations of Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) at the interface of Sn3.5Ag0.5Cu lead-free solder alloy and copper substrates were investigated by Electron Backscatter Diffraction (EBSD) technology combined with Scanning Electron Microscopy (SEM). Scalloped Cu6Sn5, Cu6Sn5 planes and six-prism shaped Cu6Sn5 IMCs were observed at the interface after 48h of soldering at 250°C. Moreover, Cu6Sn5 planes emerged in pairs on top and beside the scalloped Cu6Sn5, and two adjacent Cu6Sn5 planes were with an angle of 120°. Cu3Sn and scalloped Cu6Sn5 IMCs had preferred orientations, and they were Cu6Sn5 (0001)∥substrate surface, and Cu3Sn (1¯00) and (100)∥substrate surface.
Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Yuanyuan Qiao,Hongwei Liang,Ning Zhao

DOI: https://doi.org/10.1007/s10853-023-08310-z

IF: 4.5

2023-02-27

Journal of Materials Science

Abstract:Cu6Sn5 intermetallic compound (IMC), which occupies most even full of solder joints bringing by the reduced size of interconnection and the multi-functional demand for devices, is a critical component contributing to the reliability of the electronic products. In this study, the orientation transformation of the cold end Cu6Sn5 grains in Cu/Sn-xAg/Cu micro solder joints under temperature gradient (TG) was investigated. It was found that the orientation transformation of the Cu6Sn5 grains significantly depended on the Ag content. With increasing Ag addition, the cold end Cu6Sn5 grains transformed from strong texture with [0001]//RD(TG) to weak texture with low Ag addition or no texture with high Ag addition. The results revealed that the Ag solid solution into the Cu6Sn5 phase and the Ag3Sn absorbates on the Cu6Sn5 grain surface or at the grain boundary contributed to the above orientation transformation. The combined effect of the Ag solid solution and Ag3Sn absorbates on orientation transformation was discussed from the viewpoints of the nucleation, growth and merging of Cu6Sn5 grains, which can provide guidelines for improving the reliability of micro joints for 3D packaging or high temperature applications.Graphical abstract

materials science, multidisciplinary
Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint

Gangli Yang,Xiaoyan Li,Erhua Ren,Shanshan Li

DOI: https://doi.org/10.1016/j.intermet.2022.107555

IF: 4.075

2022-06-01

Intermetallics

Abstract:The morphological evolution and grain orientations of intermetallic compounds (IMCs) were investigated during the formation of full Cu3Sn joints at two soldering temperatures (310 and 430 °C). The mechanical properties of both types of full Cu3Sn joints were then analyzed. The experimental results showed that the morphology of interfacial IMCs varied significantly at two temperatures. At 310 °C, scallop-like Cu6Sn5 grains became larger but were fewer in number and the top of the scallops became rough due to the grain ripening effect. With the increase in the soldering temperature to 430 °C, Cu3Sn no longer grew uniformly as observed during soldering at 310 °C, but exhibited various growth rates. Furthermore, some η-Cu6Sn5 transformed into η′-Cu6Sn5 during cooling, and the following orientation groups between η′-Cu6Sn5 and η-Cu6Sn5, i.e., {102}η′ and {<math>112‾0</math>}η, {112}η′ and {<math>101‾0</math>}η, and {<math>2‾01</math>}η′ and {0001}η, were found to be near-parallel. The Cu3Sn grains were preferably oriented with [203] and [100] crystal orientations parallel to transverse direction (TD) at both temperatures. Noteworthy, the Cu3Sn grains with [203]//TD and [010]//ND grew much faster than those with other orientations at 430 °C. Moreover, molecular dynamics simulation showed that the diffusion coefficients of atoms in Cu3Sn crystals along [203] direction were significantly greater than those in other low-index crystal directions. After soldering, two types of full Cu3Sn joints obtained at different temperatures exhibited different shear strength and fracture mechanisms.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
Role of Grain Orientation in the Failure of Sn-Based Solder Joints under Thermomechanical Fatigue

Jing Han,Hongtao Chen,Mingyu Li

DOI: https://doi.org/10.11890/1006-7191-123-214

2012-01-01

Abstract:A small Pb-free solder joint exhibits an extremely strong anisotropy due to the body-centered tetragonal (BCT) lattice structure of beta-Sn. Grain orientations can significantly influence the failure mode of Pb-free solder joints under thermomechanical fatigue (TMF) due to the coefficient of thermal expansion (CTE) mismatch of beta-Sn grains. The research work in this paper focused on the microstructure and damage evolution of Sn3.0Ag0.5Cu BGA packages as well as individual Sn3.5Ag solder joints without constraints introduced by the package structure under TMF tests. The microstructure and damage evolution in cross-sections of solder joints under thermomechanical shock tests were characterized using optical microscopy with cross-polarized light and scanning electron microscopy (SEM), and orientations of Sn grains were determined by orientation imaging microscopy (OIM). During TMF, obvious recrystallization regions were observed with different thermomechanical responses depending on Sn grain orientations. It indicates that substantial stresses can build up at grain boundaries, leading to significant grain boundary sliding. The results show that recrystallized grains prefer to nucleate along pre-existing high-angle grain boundaries and fatigue cracks tend to propagate intergranularly in recrystallized regions, leading to an accelerated damage after recrystallization.
In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint

Tianhong Gu,Christopher M. Gourlay,T. Ben Britton

DOI: https://doi.org/10.48550/arXiv.1908.00401

2019-08-29

Abstract:The heterogeneous evolution of microstructure in a single Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EBSD). Local deformation due to thermal expansion mismatch results in heterogeneous lattice rotation, localised towards the corners of the joint and decreases towards the centre of the joint. This deformation is induced by the constraint from the CTE between the \b{eta}-Sn, Cu6Sn5 and Cu at interfaces. The formation of subgrains with continuous increase in misorientation is revealed during deformation, implying the accumulation of plastic slip at the strain-localised regions and the activation of slip systems (1-10)[111]/2 and (11-0)[111]/2.

Materials Science
Grain Morphology and Mechanical Strength of High-Melting-temperature Intermetallic Joints Formed in Asymmetrical Ni/Sn/Cu System Using Transient Liquid Phase Soldering Process

H. J. Dong,Z. L. Li,X. G. Song,H. Y. Zhao,J. C. Yan,H. Tian,J. H. Liu

DOI: https://doi.org/10.1016/j.jallcom.2017.06.218

IF: 6.2

2017-01-01

Journal of Alloys and Compounds

Abstract:The grain morphology and mechanical strength of the high-melting-temperature intermetallic joints formed in the asymmetrical Ni/Sn/Cu system using a transient liquid phase (TLP) soldering process were investigated. The grain morphology of the (Cu, Ni)(6)Sn-5 compounds subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the intermetallic joints. The thermodynamic analysis indicates that the critical Ni concentration which determined the grain morphology between the needlelike shape and the coarse rounded shape is approximately 11 at% at the soldering temperature of 260 degrees C. The growth of the Cu3Sn compounds was suppressed and exhibited the grain morphology of fine rounded shape. The melting temperature and the shear strength of the intermetallic joints are 418.4 +/- 0.1 degrees C and 49.8 +/- 0.3 MPa, respectively. The shear fracture was inclined to occur in the area of (Cu, Ni)(6)Sn-5 grains with the coarse rounded shape. (C) 2017 Elsevier B.V. All rights reserved.
The role of microstructure in the thermal fatigue of solder joints

J. W. Xian,Y. L. Xu,S. Stoyanov,R. J. Coyle,F. P. E. Dunne,C. M. Gourlay

DOI: https://doi.org/10.1038/s41467-024-48532-6

IF: 16.6

2024-05-21

Nature Communications

Abstract:Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened Ag 3 Sn. We then interpret the results with a multi-scale modelling approach that links from a continuum model at the package/board scale through to a crystal plasticity finite element model at the microstructure scale. We measure and explain the dependence of damage evolution on (i) the β-Sn crystal orientation(s) in single and multigrain joints, and (ii) the coefficient of thermal expansion (CTE) mismatch between tin grains in cyclic twinned multigrain joints. We further explore the relative importance of the solder microstructure versus the joint location in the array. The results provide a basis for designing optimum solder joint microstructures for thermal fatigue resistance.

multidisciplinary sciences
Mechanical Behaviors of Sn-based Solder Joints in Electronic Packaging and Assembly

AN Rong,HANG Chun-jin,LIU Wei,ZHANG Wei,TIAN Yan-hong,WANG Chun-qing

DOI: https://doi.org/10.14176/j.issn.1001-3474.2013.02.005

2013-01-01

Abstract:With the development of surface packaging technology,Soldering technology has widely served as a familiar route for interconnection between chips and substrates and for joining of substrates and print circuit boards.By now,the failure of solder joints in electronic packaging and assembly becomes a main problem concerning electronics reliability.Hence,it is necessary to describe mechanical behaviors of Sn-based solder joints and to characterize the constitutive relationship.Reviewed the results about mechanical behaviors of solder joints in terms of constitutive relationship,life prediction model,and fracture mechanisms.
The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

Xing Fu,Min Liu,KeXin Xu,Si Chen,YiJun Shi,ZhiWei Fu,Yun Huang,HongTao Chen,RuoHe Yao

DOI: https://doi.org/10.3390/ma13235497

IF: 3.4

2020-12-02

Materials

Abstract:The in-situ observation of Sn-3.0Ag-0.5Cu solder joints under electromigration was conducted to investigate the microstructure and grain orientation evolution. It was observed that there was a grain rotation phenomenon during current stressing by in-situ electron backscattered diffraction (EBSD). The rotation angle was calculated, which indicated that the grain reorientation led to the decrease of the resistance of solder joints. On the other hand, the orientation of β-Sn played a critical role in determining the migration of Cu atoms in solder joints under current stressing migration. When the angle between the electron flow direction and the c-axis of Sn (defined as α) was close to 0°, massive Cu6Sn5 intermetallic compounds were observed in the solder bulk; however, when α was close to 90°, the migration of the intermetallic compound (IMC) was blocked but many Sn hillocks grew in the anode. Moreover, the low angle boundaries were the fast diffusion channel of Cu atoms while the high grain boundaries in the range of 55°–65° were not favorable to the fast diffusion of Cu atoms.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering

Mechanical Behaviour of Grains in SnAgCu Solder Joints

Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate

Microstructural Features and Mechanical Behaviour of Lead Free Solders for Microelectronic Packaging

Mesomechanical modelling of SnAgCu solder joints in flip chip

Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints

Formation of Sn Dendrites and SnAg Eutectics in a SnAgCu Solder

Effect of Grain Orientation on Mechanical Properties and Thermomechanical Response of Sn-Based Solder Interconnects

Morphologies and grain orientations of CuSn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint

Role of Grain Orientation in the Failure of Sn-Based Solder Joints under Thermomechanical Fatigue

In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint

Grain Morphology and Mechanical Strength of High-Melting-temperature Intermetallic Joints Formed in Asymmetrical Ni/Sn/Cu System Using Transient Liquid Phase Soldering Process

The role of microstructure in the thermal fatigue of solder joints

Mechanical Behaviors of Sn-based Solder Joints in Electronic Packaging and Assembly

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints