Reassessing Self-healing in Metallized Film Capacitors: A Focus on Safety and Damage Analysis
Lei Pan,Feipeng Wang,Yushuang He,Xinbo Sun,Guoqiang Du,Quantong Zhou,Jie Zhang,Zhicheng Zhang,Jian Li
DOI: https://doi.org/10.1109/tdei.2024.3357441
IF: 2.509
2024-01-01
IEEE Transactions on Dielectrics and Electrical Insulation
Abstract:Metallized film capacitors (MFCs) are known for their self-healing (SH) properties, enabling efficient and reliable operation, even under challenging conditions. These SH events have the potential to inflict damage on both the polypropylene (PP) film and the electrode layer. However, not all types of SH damage lead to catastrophic failure of the capacitor. Thus, finding the threshold of self-healing that has little impact on the reliability of capacitor is important. This paper classifies SH events based on their SH energy, ranging from safe to risky, and establishes thresholds for safe SH. We investigate the correlation between SH energy and critical factors, such as peeling stress (adhesion between films), damage to internal components, and the number of damaged layers. For instance, at safe SH levels (< 100 mJ), peeling stress on metallized films remains below 8 N/m, while risky SH events (> 250 mJ) result in peeling stress as high as 14 N/m. Furthermore, this paper associates the equivalent parallel resistance ( R P ) with SH safety, realizing the correlation between external measurable parameters of capacitor and internal damage caused by SH events. R P serves as a valuable tool for evaluating the safety of MFCs with an unknown SH history, contributing to the assessment of their reliability.