The electrical-thermal co-simulation of integrated engineering system based on modular modeling method

Sheng Liu,Yunlu Jia,Yinghui Song
DOI: https://doi.org/10.1109/WCICA.2014.7053759
2014-01-01
Intelligent Control and Automation
Abstract:The thermal issue causing by Integrated Power System (IPS) can't be neglected. This paper focuses on the electrical-thermal co-simulation of Integrated Engineering System (IES). IES has two high coupled subsystems, it is difficult to modeling such a complex system. Besides, the large difference between electrical and thermal dynamics results in number stiff which consume more time to run a simulation of IES. For this, this presents a modular modeling method of IES for the complexity problem and proposed a reduce-order model of IPS including power management for the stiff problem. A simulation case with several typical scenarios is posed using the proposed model of IES. The interaction of the electrical and thermal subsystems can be observed visually in the simulation results, and the validity of proposed model is proved theoretically.
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