Research on Conformal EMI Shielding Cu/Ni Layers on Package

Fankun Jiang,Ming Li,Liming Gao

DOI: https://doi.org/10.1109/icept.2014.6922642

2014-01-01

Abstract:Electromagnetic noise caused by high speed digital and radio frequency electronic devices can affect the normal operation of other devices within the same system and result in significant intra-system electromagnetic interference (EMI) problems. Conformal shielding is an emerging method to prevent EMI by using metallization techniques to coat a thin metal layer around the package. In this study, copper is used as the main shielding material due to its excellent conductivity and low price. A nickel layer is plated over copper to protect the oxidation of copper. We focus on the effect of electroless plating process on adhesion and the influence of Cu/Ni thickness on shielding effectiveness. As a result, swelling for 15 minutes and etching for 5 minutes can lead to best adhesion. When copper thickness increases, shielding effectiveness first increases and then remains at a certain level. Changing nickel thickness has very little impact on shielding effectiveness.