Epoxy resin/POSS nanocomposites with low permittivity and excellent mechanical properties
Kangdi Shen,Xiaolin Zhang,Hongmei Qin,Changwei Ding,Xinxing Nie,Dan Chen,Rong Fan,Chuanxi Xiong
DOI: https://doi.org/10.1007/s10854-023-11758-z
2023-12-23
Journal of Materials Science Materials in Electronics
Abstract:Low permittivity materials are crucial for achieving high integration in circuit boards. While epoxy resins (EP) have excellent comprehensive properties, their permittivity does not meet the requirements for electronic packaging applications. In this study, we incorporated two types of Polyhedral oligomeric silsesquioxane (POSS) into EP and compared their effects on the dielectric, thermal, and mechanical properties of EP/POSS composites. The results demonstrate that EP/Ge-POSS composites exhibit superior dielectric properties compared to EP/Ao-POSS composites. Notably, the permittivity of EP/Ge-POSS composites is significantly reduced to 2.8, a 19% decrease compared to neat EP. Additionally, the mechanical properties of EP/Ge-POSS composites show remarkable improvement. For instance, the impact strength, bending strength, and tensile strength increase by 42.3%, 28.9%, and 18.9%, respectively, in EP/Ge-POSS-5wt% composites, compared to pure EP. The addition of Ge-POSS nano-particles has minimal impact on the thermal properties of the composites.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied