FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer
Bo Jiao,Lei Xu,Xinyu Yu,Haitao Yang,Haozhe Zhu,Yu Wang,Jundong Zhu,Dexin Wen,Lingli Wang,Jun Tao,Chixiao Chen,Yinhe Han,Qi Liu,Ninghui Sun,Ming Liu
DOI: https://doi.org/10.1109/tcsi.2024.3419579
2024-09-02
IEEE Transactions on Circuits and Systems I Regular Papers
Abstract:Silicon interposer re-usage is drawing attention for cost-effective multi-chiplet integrated systems. To address the communication awareness of inter/off-chiplet interconnect, the paper proposes a field-programmable interconnect fabric and develops its corresponding automatic physical integration tool. The tile-based fabric consists of turnout, cross-over boxes and parallel tracks. It features micro-bump-wise connecting flexibility and hardware efficiency. The automation flow performs chiplet location optimization and efficient bump-to-bump routing, supporting multi-lane bus interconnect and miscellaneous external ports. The methodology is validated by 9 different integration scenarios, where the routability is guaranteed when the local resource utilization ratio approaches 94.5%. The data's maximum interconnect latency is 2.2 ns and the energy consumption is 1.18 pJ/bit at a bitrate of 1 Gbps. The latency consumes fewer clock cycles than the state-of-the-art network-on-package-based reusable interposer architectures.
engineering, electrical & electronic