Abstract:The rapid development of high-power integrated electronic devices for 5 G system has created an urgent requirement for thermally conductive and electrically insulating materials, which has attracted significant research interest, especially for the engineering materials with mechanical flexibility and anisotropic thermal conductivity. In this study, exfoliated hexagonal boron nitride nanosheets (BNNSs) were incorporated in thermoplastic polyurethane (TPU) with varying contents of 10, 20 and 30 wt% through the solution-melt compounding. Then samples for testing were fabricated from the composites by 3D printing, and their thermal conductivity and tensile properties were evaluated to explore the structure-activity relationship. Results showed that the effects of melt squeezing and shear flow occurred during in 3D printing process were dominant in enabling the orientation of BNNSs within the TPU matrix, which was found to be more dependent on the ratio ( h / d n ) of layer thickness h to nozzle diameter d n and less dependent on the printing speed v . Such in-plane orientation of BNNSs combined with the rastering structure of the deposited strands in the warps and wefts and the low density of inner voids were helpful to improve the mechanical and thermal conductive performance of printed BNNS/TPU composites, demonstrating a much better retention of tensile strength and greatly increased thermal conductivity than those of molded samples via hot compression. In addition, the performance of printed composites was also beneficial from the size effect of BNNSs, which could not be achieved without nano exfoliation. As a result, the tensile strength and elongation at failure of the BNNS/TPU composites with 30 wt% loading were 106.2% and 116% higher than those of printed BN/TPU composites, respectively. In addition, anisotropic thermal conductivity of printed BNNS/TPU in the printing direction and thickness direction increases from 1.51 to 1.80 Wm -1 K -1 and from 1.26 to 1.30 Wm -1 K -1 , representing increases of 19.21% and 3.17%, respectively.

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Mille-Feuille Inspired Thermally Conductive Polymer Nanocomposites with Overlapping BN Nanosheets for Thermal Management Applications.

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Preparation of AlN microspheres/UHMWPE composites for insulating thermal conductors

Polymer/Alumina Nanofiber Composite Sheets with Anisotropic High Thermal Conductivity

Dual Network Structures of Polyurethane/Boron Nitride Nanosheets/Alumina for Improved Thermal Management of Polymers

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Improving thermal conductivity of epoxy composite by three-dimensional filler network constructed with two different diameters aluminum nitride and cellulose nanofiber

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The combination of AlN and h‐BN for enhancing the thermal conductivity of thermoplastic polyurethane composites prepared by selective laser sintering

Facile Preparation of Polymer-Based Heat Dissipation Composite Coating with Enhanced Thermal Conductivity Via Optimizing Synergistic Effect of Multi-Scale Fillers

Hot-pressing Induced Alignment of Boron Nitride in Polyurethane for Composite Films with Thermal Conductivity over 50 Wm−1 K−1

Millefeuille-Inspired Thermally Conductive Polymer Nanocomposites with Overlapping BN Nanosheets for Thermal Management Applications

Enhanced thermal conductivity of epoxy resin by incorporating three-dimensional boron nitride thermally conductive network.

The Use of Polyimide-Modified Aluminum Nitride Fillers in AlN@PI/Epoxy Composites with Enhanced Thermal Conductivity for Electronic Encapsulation

High Dielectric Thermal Conductivity Polyvinylidene Fluoride Composites Based on Surface‐Modified Graphene Nanosheets and Aluminum Nitride

Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes

3D Printing Boron Nitride Nanosheets Filled Thermoplastic Polyurethane Composites with Enhanced Mechanical and Thermal Conductive Properties

Preparation of Flexible and Elastic Thermal Conductive Nanocomposites Via Ultrasonic-Assisted Forced Infiltration

Enhanced Thermal Conductivity of Epoxy Adhesive Films by Filling Surface-Modified AlN