Solder joint inspection method based on image feature statistical analysis

Hongwei Xie,Xianmin Zhang,Yongcong Kuang
DOI: https://doi.org/10.19650/j.cnki.cjsi.2011.02.026
2011-01-01
Abstract:In order to improve the performance and maneuverability of online automatic optical inspection system, a novel method for post-reflow solder joint inspection based on image feature statistical analysis is proposed in this paper. Dual-threshold AdaBoost algorithm is used to design the classifier. Optimal features are selected and classifier is enhanced during the training process. Features of the solder joints are selected and detection parameters are set automatically. The solder joint defect decision method is transformed into a binary decision tree to improve the detecting speed. Experimental results prove that the training time is short enough to satisfy the actual production requirements. Compared with the image comparison method and image feature analysis method that have been applied in practical production, the method proposed in this paper has higher inspection precision while maintaining detecting speed.
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