A new dynamic grids based on temperature analogy and its application in vibration engineering with fluid-solid interaction

Yan CHEN,Shu-liang CAO,Kai-hong LIANG,Bao-shan ZHU
DOI: https://doi.org/10.3969/j.issn.1000-3835.2010.04.001
2010-01-01
Abstract:A new dynamic grids method was presented by using temperature analogy. The displacement of a moving boundary was considered as temperature boundary conditions, the internal nodes displacements were obtained by solving energy equations or heat conduction equations. The temperature analogy was used to solve fluid-structural interaction problems. Examples included forced vibration of a thin cambered blade and vortex induced self-excited vibration of a cylinder. Compared with other methods, the temperature analogy was more efficient and robust. The results showed the temperature analogy can effectively solve the dynamic grids problems in vibration engineering.
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