Modeling of dynamic recrystallization in Cu-Ni-Si-Ag alloy

Yi Zhang,Ping Liu,Baohong Tian,Shi Zhang,Xiaohong Chen,Shuguo Jia,Yong Liu
DOI: https://doi.org/10.3870/tzzz.2010.09.002
2010-01-01
Abstract:Dynamic recrystallization behavior and microstructural evolution of Cu-2. 0Ni-0. 5Si-0. 15Ag alloy during hot compressive deformation were investigated by isothermal compression testing at the Gleeble1500D thermal-mechanical simulator at the temperature from 600°C to 800°C with strain rate, from 0.01s-1 to 5s-1 under the condition of 60% strain. Recrystallized fraction at varied deformation conditions was determined based on σ-ε curves, which was employed to establish kinetic equation for dynamic recrystallization in the alloy. The dynamic recrystallized microstructure depend on the deformation strain rates. Relationship between the dynamic recrystallization grain and parameter Z is as follows: Ddyn = 0. 59 × 103 Z-0.08. Cu-2. 0Ni-0. 5Si-0. 15Ag Alloy, Dynamic Recrystallization Fraction, Kinetic Equation, Dynamic Recrystallization Grain Model.
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