An analysis on recycling of non-metal material from waste printed circuit board

Siting Wang,Huabo Duan,Weifeng Jia,Jinhui Li
2009-01-01
Abstract:As one of the essential parts in electronic industry, printed circuit boards (PCBs) are widely used in varieties of Electronic and Electric Equipments (EEE). The recycling of waste PCBs is becoming a popular research area. In this paper, we propose that the non-metal material in PCBs can be mixed with polypropylene as padding material to form a new composite material. The experiment demonstrates that the density of the new material is rising when the Non-Metal Additive Percentage (NMAP) increases. The mechanics performance also shows that there are dramatic rises in both bending strength and impact strength. Furthermore, a NMAP of 30% optimizes the new composite material's mechanics performance. Additionally, the shrinking ratio performs a remarkable decline in contrast with pure polypropylene material. Therefore, the proposed recycling technique of the non-metal from PCBs may become a potentially attractive solution to reuse waste PCBs.
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