Nano Resonator Simulation Fabrication And Packaging Consideration

Zhang Wei,Liu Zewen,Wang Zheng
DOI: https://doi.org/10.1109/ICEPT.2009.5270700
2009-01-01
Abstract:A study on simulation, fabrication and packaging of metallic nano resonator is presented. The nano resonator is modeled with an equivalent circuit and simulated using HSPICE. CMOS compatible process is used to fabricate the nano resonator with a minimum modification The suspended part of the device is released using HF vapor-phase etching. Packaging of nanoscale device is conceived based on the features, fabrication process and the application of the nano resonator.
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