Out-of-Plane Hollow Metallic Microneedle Based on MEMS Technology

Xiu-cheng SHEN,Jing-quan LIU,Ya-jun WANG,Zhong-yuan GUO,Yue-feng RUI
DOI: https://doi.org/10.3969/j.issn.1004-1699.2009.02.001
2009-01-01
Abstract:An important application of MEMS microneedle is transdermal delivery. An out-of-plane metal microneedle is fabricated based on MEMS technology. An inverse pyramid with the depth of 330 μm was first etched on a silicon chip using (100) silicon surface etching technology. Then a hollow metal inverse pyramid with the wall thichness of 50 μm was fabricated using electroplating technology. From the back side, micro channel was fabriated and then the silicon left was removed. An out-of-plane metal hollow microneedle with an incline angle of 70.6° was obtained. Finally, the model of the microneedle is built by the FEM software ANSYS to validate that the microneedle have enough strength.
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