Hot Deformation Behavior and Microstructural Evolution of Pure Aluminum

Huizhong Li,Xiaopeng Liang,Jianmei Chen,Chuming Liu
DOI: https://doi.org/10.3870/tzzz.2009.01.030
2009-01-01
Abstract:Microstructural evolution of a commercial pure aluminum during hot compression at elevated temperatures was observed by OM (optical microscope) and TEM (transmission electron microscope) with Gleeble-1500 dynamic materials testing machine at different compression rates. The results indicate that true stress-true strain curves are characterized by steady state with a strain rate of 0.01 s-1 at 220°C and 300°C, exhibiting occurrence of dynamic recovery, while occurrence of dynamic recrystallization in the pure aluminum can be observed at temperature more than 380°C. Furthermore, dynamic recrystallization occurs in the pure aluminum with a strain rate of 0.001-1 s-1 and at 460°C. Dynamic recrystallization mechanism is characterized by continuous dynamic recrystallization and geometric dynamic recrystallization.
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