Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging

Ziyang Xiu,Guoqin Chen,Zongquan Deng,Gaohui Wu
DOI: https://doi.org/10.1109/ICEPT.2008.4607091
2008-01-01
Abstract:Sip/1199Al composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. The microstructure observation showed that the composites were dense and Si particles distributed uniformly; The linear CTEs of Sip/1199 composites was between (8.1~12) times 10-6degC-1, and they were decreased with the increasing content of Si particles as well as annealing treatment; the thermal conductivity can reach 150 W/ (mmiddotdegC), which was decreased with the increasing contents of Si particles as well as annealing treatment. The composites had excellent mechanical properties and also could be recycled.
What problem does this paper attempt to address?