Abstract:Thermal issue has significant effect on the reliability and performance of integrated circuits (ICs) with the increase of integrated density, especially for 2.5-D and 3-D heterogeneous integration packaging systems. In this paper, a new highly efficient 3-D transient thermal distribution model has been constructed to capture the heat conduction behavior of multiple heat sources for chiplet heterogeneous integration (CHI) by improving the alternating direction implicit finite difference method (ADI-FDM). Firstly, a new floating optimization algorithm (FOA) of coefficient matrix assignment of heat conduction equation and a new boundary treatment utilizing virtual points are proposed to modify the ADI-FDM and improve the model efficiency of thermal analysis. Furthermore, a universal equivalent thermal conductivity model is also built up to describe the design features of through silicon via (TSV), bump and redistribution layer structures, which can enhance the flexibility of FDM-based thermal simulator. Compared with previous finite element analysis results, the present FOA-accelerated thermal model can not only obtain an accurate simulation result of temperature profile, but also give a simulation efficiency of 3.74 times faster than Douglas-Gunn approach for the coefficient matrix assignment. Finally, the effect of power consumption variation and the floorplaning effects of chiplets, TSVs and bumps on the temperature distribution are investigated in detail by utilizing the present FOA-based thermal solver. The simulated results of the present work demonstrate the viability and computational efficiency for temperature field optimization and indicate that the new proposed simulator is helpful in thermal analysis of packaging structures and can be adopted to assist in physical design optimization of 2.5-D CHI or 3-D heterogeneous stacked chips.

Exploiting Thermal-Area Tradeoffs In High-Level Synthesis Through Resources Number Selection

Thermal-aware Resource Usage Allocation

Power-and thermal-aware mapping for NoC under latency constraint

Exploiting Power-Area Tradeoffs In High-Level Synthesis Through Dynamic Functional Unit Allocation

Peak Temperature Control in Thermal-Aware Behavioral Synthesis Through Allocating the Number of Resources

Peak Temperature Reduction by Physical Information Driven Behavioral Synthesis with Resource Usage Allocation

A Novel Thermal Optimization Flow Using Incremental Floorplanning for 3D ICs

System-Level Analysis of 3D ICs with Thermal TSVs

A Low Computational Cost and Accurate Thermal Calculation Method for Multi-hotspot IC

Adaptive Chip-Package Thermal Analysis for Synthesis and Design

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation.

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Thermal analysis & optimization of a 3 dimensional heterogeneous structure

An Overview of Power Optimization in High Level Synthesis

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Optimizing the heat source layout of chips using bionic method: Reduction of junction temperature

A Thermal-Aware Ilp-Based Algorithm In Behavioral Synthesis

An Efficient Thermal Optimization Flow Using Incremental Floorplanning For 3d Microprocessors

A layout-to-simulation approach for thermal design of IC

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Coupling management optimization of temperature and thermal stress inside 3D-IC with multi-cores and various power density