Abstract:Immersion lithography seeks to extend the resolution of optical lithography by filling the gap between the final optical element and the wafer with a liquid characterized by a high index of refraction. The semiconductor industry demands high throughput, leading to relatively large wafer scanning velocities and accelerations. For higher scanning velocities, an issue that has been identified is the deposition of the immersion liquid while confining a relatively small amount of liquid to the under-lens region. Liquid loss occurs at the receding contact line that forms when a substrate is withdrawn from a liquid, which potentially leads to defects on printed patterns. There has been substantial prior work relative to understanding and building semi-empirical correlations and numerical models to investigate this behavior of the receding three-phase contact line. In the current work, a new liquid injection and collection model with analytic solutions is presented and compared with experimental results, in which the critical velocity for liquid loss is mainly a function of the vacuum degree, the injection flow rate, the properties of the immersion liquid. This correlation allows the critical velocity to be predicted with a given gap height between wafer and lens using only a measurement of the injection speed and knowledge of the fluid properties. Experimentally, glycerin-water mixtures of varying viscosities and different injection flow rates were tested, with variable outlet vacuum degree and inlet speed, showing a mean average error within 12%. This correlation represents a useful tool that can serve to approximately guide the development of fluid control for immersion systems as well as to evaluate alternative immersion fluid candidates to minimize liquid deposition while maximizing throughput.

Analysis of Thermal Properties of Liquid for Exposure in ArF Immersion Lithography

Simulation and Experimental Investigation of Immersion Flow Field in Immersion Lithography

SIMULATING PRESSURE DISTRIBUTION ON LENS RELEVANT TO FLUID INJECTION FOR IMMERSION LITHOGRAPHY

Investigation on the critical velocity for liquid loss in immersion lithography

Simulation Of The Velocity Distribution For Immersion Lithography

Flow Behavior Control in Immersion Lithography

Modeling fluid velocity response for wafer scanning in immersion lithography

Effect of Liquid Dispensing on Flow Field for Immersion Lithography

Lens distortion for liquid renovation in immersion lithography

Study of temperature distributions in wafer exposure process

Performance Analysis of Double-Fluid-Layer Achromatic ArF Immersion Interference Lithography

Axisymmetric thermo-mechanical analysis of laser-driven non-contact transfer printing

Thermo-mechanical Modeling of Laser-Driven Non-Contact Transfer Printing: Two-Dimensional Analysis

The detection and prevention of air bubbles in immersion liquid

Finite element analysis of temperature distribution during the laser 265 heating of a metal in a liquid medium: As applied to the specific case of laser electrochemical etching

Impact on Fluid Flow State by Different Structural Parameters of Immersion Lithography Unit

Infrared Characterization of Thermal Convection of Liquid-layer in Semiconductor Etching Process

Thermal design aspects for improving temperature homogeneity of silicon wafer during thermal processing in microlithography

Study on Flare in ArF Immersion Lithography

Dynamic Simulation on the Temperature Field of Laser Micro-Patterning Metal in the Liquid

DESIGNING AND EXPERIMENTAL INVESTIGATION OF AN IMMERSION UNIT WITH DOUBLE GAS-CURTAIN SEALING FOR IMMERSION LITHOGRAPHY