Abstract:We demonstrated a novel approach to synthesize flexible isotropic conductive adhesives (ICAs) that can not only withstand a high deformation rate but also exhibit superior electrical conductivity and adhesion strength. The ICA is made of polyurethane (PU) filled with silver flakes. It can achieve resistivity as low as 1.1×10-5 Ω.cm at 80 wt.% loadings, which is even better than most solders. The high electrical conductivity results from 1) large shrinkage of the PU matrix during cuing; 2) the in-situ reduction of the silver carboxylate layer present on the surface of silver flakes by the selected curing agent so that direct metallic contact can be formed between silver flakes; 3) the microphase separation that is unique to PU matrix providing more conduction paths. The combination of the three above effects leads to the superior electrical conductivity that can be rarely seen in other ICA materials at equivalent loading level. In terms of adhesion, lap shear test measurements show that the adhesion strength to Cu surfaces at room temperature can reach 0.12 kg/mm2 at 80 wt% loading, equivalent to some epoxy based ICAs reported before. In addition, the developed ICAs have also demonstrated other advantages such as a low curing temperature, which enable them to be printed on low cost and flexible substrates such as paper and fabrics; simple and cost-effective processing, eliminating the usage of Ag nanoparticles to achieve high electrical conductivity; and good bio-compatibility. These superior material properties combined with low cost and simple processing make it very promising for emerging flexible electronics. A wearable antenna fabricated by printing the PU based ICAs on flexible fabrics was also presented as a demonstration of such devices.

Properties of Isotropical Conductive Adhesives Filled with Carbon Nanotubes

Properties Investigation on Isotropical Conductive Adhesives Filled with Silver Coated Carbon Nanotubes

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Isotropical Conductive Adhesives Filled with Silver Nanowires

High conductivity of isotropic conductive adhesives filled with silver nanowires

Influence of Filler Morphology on Percolation Threshold of Isotropical Conductive Adhesives (ICA)

Effect of hybrid nanofillers on thermal conductivity of composite phase change materials

Length-dependent Electrical and Thermal Properties of Carbon Nanotube-Loaded Epoxy Nanocomposites

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Electrically Conductive Adhesives Based on Thermoplastic Polyurethane Filled with Silver Flakes and Carbon Nanotubes

Thermo-mechanical Properties of Isotropic Conductive Adhesive Filled with Metallized Polymer Spheres

Using Novel Materials to Enhance the Efficiency of Conductive Polymer

Effect of Ti3C2Tx/Ag/MWCNTs/Ag MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives

Effect Analysis of Filler Sizes on Percolation Threshold of Isotropical Conductive Adhesives

Flexible thermoplastic conductive adhesive with high reliability

Wetting behavior of AgCu-4.5Ti filler reinforced by carbon nanotubes on C/C composite

Electrically conductive adhesives filled with surface modified copper particles

Thermal Conductivity Improvement Of Silicone Elastomer With Carbon Nanotube Loading

Highly conductive, flexible, bio-compatible poly-urethane based isotropic conductive adhesives for flexible electronics

Self-healing Isotropical Conductive Adhesives Filled with Ag Nanowires

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires