A Parametric Study for Dispersion of Guided Wave Modes in Bonded Plates Using the Spring Model

J Du,JC Cheng
DOI: https://doi.org/10.1063/1.1916677
2005-01-01
AIP Conference Proceedings
Abstract:The dispersion of the cylindrically symmetric guided wave modes in two-layer bonded plates are analyzed numerically for different cohesive situations characterized by the stiffness coefficients of the spring model. We found that there exists a physically impossible mode, which has a group velocity approaching infinity at low frequency, and a systematic study of the parameter space of stiffness coefficients shows the spring model results intrinsically in this shortcoming for modeling the adhesive bond interface.
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