Conduction Current Characteristics of Thermally Aged Polyimide Films Based on Physico-chemical Analysis
Yajun MO,Ling ZHANG,Yuanxiang ZHOU,Jie LIU,Yunxiao ZHANG,Zhongliu ZHOU
DOI: https://doi.org/10.13336/j.1003-6520.hve.20190329021
2019-01-01
Abstract:In order to study the effect of thermal aging on the conduction current of PI films, accelerated experiments are conducted with PI films at 300 ℃ for 10, 20 and 30 days respectively. The comprehensive tests and analysis, including FTIR, SEM, DC breakdown strength, dielectric performance and conduction current, were followed. The results show that the tensile strength, the relative content of imide group, and DC breakdown strength remarkablydecrease after thermal aging. Moreover, pores and defects appear on the surface of PI films. The measured results of conduction current show that the electrical degradation threshold decreases after thermal aging, while the conduction current increases. As the test temperature increases, the electrical degradation thresholds of both unaged and 30-day aged PI samples increase. The analysis results reveal that the imide linkage and ether linkage are broken during the long-term accelerated thermal aging, and part of the group reacts with oxygen and subsequently escapes in gas form. Thus surface defects will appear, the tensile strength will decrease, the trap density will increase, and the accumulation of space charge will be easy to occur, which lead to the decrease of the electrical degradation threshold. The conductivity of the same sample mainly differs in the ohmic region at different temperatures, which resultsin the increase of the charge carrier mobility, making it more difficult to accumulate space charge and increasing the electrical degradation threshold.