Numerical Analysis of Solid-Liquid Two-Phase Abrasive Flow in Microcutting Polycrystalline Materials Based on Molecular Dynamics
Jun-Ye Li,Wen-Qing Meng,Kun Dong,Xin-Ming Zhang,Wei-Hong Zhao
DOI: https://doi.org/10.1007/s12541-018-0187-8
IF: 2.0411
2018-11-01
International Journal of Precision Engineering and Manufacturing
Abstract:Abrasive flow polishing plays an important role as a type of precision nanomachining technology. In this study, the polishing mechanism of abrasive flow was studied using numerical simulations based on molecular dynamics. In order to study the polishing mechanism of polycrystalline materials, the molecular dynamics simulation of three kinds of polycrystalline materials was carried out. The cutting force, energy, friction coefficient, and surface morphology (during the microcutting process) of the three workpiece materials were analyzed. The analysis shows that the adhesion of atoms in the contact area on the workpiece surface will be affected by liquid phase and the type of abrasive particles, and then the surface quality polished by the abrasive flow will also be influenced. The onset of an abrasive flow polishing process involving plastic deformation (including the nucleation and migration of dislocations, grain boundary shape deformation, and deformation twinning) was observed on the workpiece surface. Defects strongly competed with each other in the form of interactions of dislocations and the grain boundaries, resulting in the migration of twin boundaries. A further analysis of the numerical results for different cutting depths and abrasive properties of the workpiece materials will be useful for understanding the different cutting effects.
engineering, mechanical, manufacturing