Analyses of Transient Temperature and Thermal Stress Distribution in Ring Laser Diode Array Pumped Laser Rod

欧群飞,陈建国,冯国英,张申金,朱海波,李明中,唐军,罗亦鸣,邓青华,王建军

DOI: https://doi.org/10.3321/j.issn:0253-2239.2004.06.019

2004-01-01

Abstract:Based on the intensity distribution of the pumping laser diode, the distribution of the heat deposition inside the gain medium of a ring laser diode array (LDA) side-pumped solid-state rod laser was obtained by using the ray tracing method. The transient temperature rise and thermal stress distributions were calculated by using the finite element method. The temperature rise and thermal stress were discussed under different input power and different rod radius. The results show that temperature distributions are different under different pump structure parameters. And the rise time to steady state grows with the increase of the rod radius but not with the pump power. The temperature rises with the pump power and so does the thermal stress, which may cause serious problems such as fracture around the center and surface of the laser rod.