Effect of n-SiO2 on electrodeposition of nickel and chemical bonding interaction between nanoparticles and matrix metal in the composite coating

Weiyi Tu,Binshi Xu,Shiyun Dong,Bin Jiang,Lingzhong Du,Zhenfeng Hu
DOI: https://doi.org/10.3321/j.issn:0567-7351.2004.20.008
2004-01-01
Acta Chimica Sinica
Abstract:The electrochemical response from n-SiO2/Ni composite brush plating system was researched by means of cyclicvoltammetry and potential step. The interaction between nanoparticles and matrix metal nickel was investigated by X-ray photoelectron spectrometry. The results show that nanoparticles lead to increasing of the current efficiency, ratio of nucleation and crystal growth rate as well as decreasing of overpotential. Nanoparticles can catalyze the nickel electrodeposition and reduce the size of metal crystal. As the nickel atoms reduced on cathode are diffusing on the metal growth surface, the unsaturated bond of oxygen atoms on nanoparticle surface can capture some of the absorbed nickel atoms and form nickel-oxygen chemical bond. It is proved that the chemical bonding interaction exists on the interface between nanoparticle surface and matrix metal nickel.
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