Abstract:Our world is an analog world, and the ways in which we interact with it are also analog. Today, more integrated circuits and systems contain analog components. Meanwhile, digital functionalities are increasingly put into analog systems to enhance their performance. System-On-Chip designs consisting of analog, digital, RF and software blocks are commonplace. New technologies allow for the integration of as many features as possible on one or more silicon die. At the same time, integrated systems have had to become more flexible to cover a wider range of use-cases, as heavily increasing design and production set-up costs have made highly targeted application-specific design more difficult to justify. Also, the reliability of today's electronic systems has been challenged by the increasing probability of device failure as the feature sizes of integrated circuits are pushed well into the nanometer scale range and three-dimensional geometry is explored to extend VLSI process potential. The combined effect of a continually increased presence of analog circuits and IP blocks in a system as well as the coupling between densely integrated components/subsystems has an impact to the operation reliability and performance that is too complex at the transistor level. Electronic system level design/verification is now an established approach at most of the world's leading semiconductor companies and is being adopted increasingly to solve the complex mixed-signal System-On-Chip (SoC) problem at early stages, leading to a shorter design period. From noise, some typical mixed-signal circuits, to a whole application SoC—a Near Field Communication system, SystemC/SystemC-AMS shows its powerful feature as an ESL design language. In this dissertation, I will discuss examples modeled at the system level in detail. On the other hand, it is often difficult to develop a high-level model at the appropriate abstraction level that can ensure the best trade-off between architectural details and simulation speed. To this end, engineers perform simulations at different levels. Because of that, we developed a Cross-Layer Simulator which is shown in this document. This co-simulator, based upon Ngspice and SystemC/SystemC-AMS, can handle a mixed-signal SoC at different abstraction levels in one model and simulation. Case studies on different circuits prove its ability to function well in terms of both precision and speed for circuits/systems simulation.

Mixed-Mode Simulation of High Voltage and Power IC

A New Method for Power-Aware Signal Integrity Analysis with Spice Model of Power Distribution Network

Research Of Designing For The High Voltage Device In Cmos Hv-Ic

The Modeling Simulation of Magnetic-Coupled-Coils in Multisim 9.0

A Novel Gate Control Strategy for 3.4kv Cascade Sic Mosfets Stack

Modeling of Sic Mosfet in Matlab/Simulink

Fast voltage drop modeling of power grid with application to silicon interposer analysis

Research on the Simulation Methods for Power Electronic Devices Based on C++

A Low-Cost High-Performance Voltage Sensing Circuit with Proactive Parameter Design Compensation Network for SiC MOSFETs.

Modeling of the Simultaneous Switching Noise in High Speed Electronic Circuit with the Integral Equation Method and Vector Fitting Method

Modeling And Simulation For Conducted Common-Mode Current In Switching Circuits

Advance of Real Time Digital Simulation for High-power Electronics

System/architecture level design and modeling of mixed-signal soc using systemc/systemc-ams and cross-layer co-simulation tool

IGBT Switching Characteristic Curve Embedded Half-Bridge MMC Modelling and Real Time Simulation Realization

The Impact of Nonlinear Junction Capacitance on Switching Transient and Its Modeling for SiC MOSFET

Event-Driven Approach with Time-Scale Hierarchical Automaton for Switching Transient Simulation of SiC-Based High-Frequency Converter

Modeling and Simulation of Multilevel Current Source Inverter Based on Simetrix/Simplis

Mechanism and Analytical Model for Switching Transient Process in SiC 3L-ANPC Converter

Mixed-mode simulation-design for IEC-ESD protection

SPICE Modeling of Three Novel SiC MOSFETs with Integrated Junction-Barrier-Schottky Diode

Analytical Transient Model of Commutation Units with SiC MOSFET and SiC SBD Pair