Characterization Of Cresol Epoxy By Time-Of-Flight Secondary Ion Mass Spectrometry

Yiyong Pan,Yuesheng Li,Yongming Cao,Weixiao Chen,Xiangfu Zong
DOI: https://doi.org/10.3321/j.issn:0253-3820.1999.02.008
IF: 1.193
1999-01-01
Chinese Journal of Analytical Chemistry
Abstract:Cresol epoxy used typically in microelectronic packaging has been characterized by time-of-flight secondary ion mass spectrometry using silver cationization technique. Oligomers containing up to 4 repeat units were detected with their hydrolytic components. Fragment ions characteristic of resin structure were detected in addition to the aromatic ions generally formed from aromatic compounds. It is concluded that side chain scission is mostly to take place in middle benzene ring.
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