Abstract:Random via failure is a major concern for post-fabrication reliability and poor manufacturing yield. A demanding solution to this problem is redundant via insertion during post-routing optimization. It becomes very critical when a multi-layer routing solution already incurs a large number of vias. Very few global routers addressed unconstrained via minimization (UVM) problem, while using minimal pattern routing and layer assignment of nets. It also includes a recent floorplan based early global routability assessment tool STAIRoute \cite{karb2}. This work addresses an early version of unconstrained via minimization problem during early global routing by identifying a set of minimal bend routing regions in any floorplan, by a new recursive bipartitioning framework. These regions facilitate monotone pattern routing of a set of nets in the floorplan by STAIRoute. The area/number balanced floorplan bipartitionining is a multi-objective optimization problem and known to be NP-hard \cite{majum2}. No existing approaches considered bend minimization as an objective and some of them incurred higher runtime overhead. In this paper, we present a Greedy as well as randomized neighbor search based staircase wave-front propagation methods for obtaining optimal bipartitioning results for minimal bend routing through multiple routing layers, for a balanced trade-off between routability, wirelength and congestion. Experiments were conducted on MCNC/GSRC floorplanning benchmarks for studying the variation of early via count obtained by STAIRoute for different values of the trade-off parameters ($\gamma, \beta$) in this multi-objective optimization problem, using $8$ metal layers. We studied the impact of ($\gamma, \beta$) values on each of the objectives as well as their linear combination function $Gain$ of these objectives.

Neural network approach for via minimization in multi-layer VLSI/PCB routing

Via minimization algorithm for double-layer in VLSI and PCB.

Via-aware global routing for good VLSI manufacturability and high yield

A New Via Chain Design Method Considering Confidence Level and Estimation Precision

Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

Artificial Neural Network Models for the Double-Vias in Multilayer Stripline Circuits

Vertical Via Design Techniques for Multi-Layered P/G Networks

System partitioning on MCM using a new neural network model

Study of Via Optimization Problem Based on Estimation of Distribution Algorithm

Area minimization of power distribution network using efficient nonlinear programming techniques

The application of neural networks to EM-based simulation and optimization of interconnects in high-speed VLSI circuits

Congestion Based Layer Assignment of Global Routing

Routing Congestion Prediction in VLSI Design Using Graph Neural Networks

Modeling and Analyses of Vias in Multilayered Boards with the Aid of Look-Up Tables

Novel Location-Constrained Virtual Network Embedding LC-VNE Algorithms Towards Integrated Node and Link Mapping

Optimization of Via Distribution and Stacked Via in Multi-Layered P/G Networks

Exploring the Scope of Unconstrained Via Minimization by Recursive Floorplan Bipartitioning

Analog routing considering min-area constraint

One Method for Via Equivalent Circuit Extraction Based on Structural Segmentation

Multi-layer gridless routing algorithm with V-shaped framework

Hybrid Fast Modeling of Via-Connected Traces in Multilayer Electronic Packages