Study of low temperature curable bismaleimide resins (2). Chain-extended BMI/diallyl bisphenol A system

Rumin Wang,Shuirong Zheng,Kehe Su
1997-01-01
Abstract:This paper tried to use diamine extender and diallyl bisphenol A comonomer to increase toughness of modified resin. An optimum resin formulation cured at 150��C was obtained by using a computer-aided quadratic regression orthogonal combination design method. The resin casts have been detected to have the middle toughness and excellent heat resistance. The composites have good mechanical properties.
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