Simulation software for microwave integrated circuits and interconnections: Tsinghua Microwave SPICE

Baoxin Gao,Jinsong Zhao,Naiqian Zhang,RunSheng Liu
1996-01-01
Abstract:The design of microwave integrated circuits is more and more dependent on CAD software and the analysis of interconnection is urgently calling for software tools. This paper describes our many years work on the simulation software for microwave integrated circuits and interconnections: Tsinghua microwave SPICE (TMS), which, based on the source codes of SPICE 3e2, the general purpose circuit simulator, includes many special features for microwave circuits and interconnections. The essential techniques include models of microwave passive elements and their embedding into nodal analysis software, time domain analysis of an arbitrary passive network (including interconnection), acceleration of circuit analysis when applied to electromagnetic analysis, the design of the schematic editor. Microstrip discontinuity models and the time domain analysis ability in TMS have high accuracy. TMS, as powerful simulation software for microwave integrated circuits and interconnections, is expecting more real design applications.
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