Ready-assemble compact morphological processor

Haifeng Peng,Liren Liu,Yaozu Yin,Zhijiang Wang
1995-01-01
Abstract:Based on the polarization-optical interconnection unit, ready-assemble compact morphological processor with high packaging density has been developed. It is compact in structure, insensitive to environmental disturbance and effective in performance. Principle of the morphological processor and its packaging density were described in detail. The maximum packaging density of 30/mm3 can be achieved. Using the polarization-optical interconnection unit, experimental study on the morphological processor system has been made. The experimental result was given.
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