A microscopic mechanics model of crack growth with fatigue-creep interaction
Yi Sun,Rei Zhang,Jun Ma,Jianmin Qu
2004-01-01
Abstract:Many engineering components, such as steam turbine rotor systems, outer shell of nuclear reactors, or even solder connection in electronic packing, are prone to thermal fatigue under service condition. As their working temperatures are relative high, they may also endure creep damage. Up till now the most common way to treat the fatigue-creep problem is to make a simple linear superposition of the individual effects. However, the interaction between creep and fatigue is proved to be an important factor in engineering safety design[1]. It is also a very complex and difficult problem for researchers in the relative fields. In the present work, an analytical micromechanics model is proposed to describe the influence and interaction of fatigue and creep. Here, a recently proposed fatigue crack growth model[2] is adopted which views the fatigue crack growth process as the intermissive elastic cleavage fracture of the dislocation free zone (DFZ). The effects of cyclic loading make the plastic zone hardening (or softening), thus raise the stress level in DFZ and bring it to fracture. The calculated dN dc / curves exhibit three different stages of fatigue crack growth which is in general agreement with the experimental observation. In applying that model to thermal fatigue, we consider the following thermal loading condition (fig. 1). Here we suppose that, compared with the holding period at high temperature, the period of increasing and decreasing temperature is rather short, and the creep during that period may be neglected.