Abstract:Understanding heat transfer process of liquid thin film evaporation in porous media or on microstructured surfaces is the key for optimal designs of phase-change based thermal management devices, such as vapor chambers or flat heat pipes. In this paper, a newly developed 3D thermal Lattice Boltzmann method (LBM), incorporating double distribution functions (DDF), pseudo-potential model and equation of state (EOS) of a real gas, is used to simulate dynamic evaporation along the vapor/liquid interface and boiling in the liquid thin film on a microstructured surface consisting of micro pillars. Simulations are conducted under constant heat fluxes for four solid hydrophilic surfaces with contact angles of 10°, 23°, 37° and 63° respectively. Residual liquid volume, two-phase interface morphology, wall temperature distribution, as well as effective heat transfer coefficient and CHF under different conditions are discussed in details. With increasing heat flux, it is found that the liquid thin film recedes gradually into the wick structure, with the lowest liquid level at the center of the heating area, to maintain a continuous liquid supply via capillary pumping. The receding of the liquid thin film can normally enhance evaporation heat transfer because it not only reduces the thermal conduction resistance of liquid thin films, but also elongates the evaporating liquid meniscus along the height direction of micro pillars. For larger contact angles of 37° and 63° for example, dry-out initiates from the heating center at a sufficiently high heat flux, leading to serious deterioration of heat transfer with expansion of the dry-out area. However, for smaller contact angle of 10° and 23°, fixed and periodical bubble nucleation appears sequentially before dry-out heat flux. At small heat fluxes, there is no obvious difference in effective heat transfer coefficient for four hydrophilic surfaces. On the other hand, considerable increase of effective heat transfer coefficient can be obtained at higher heat flux on a stronger hydrophilic surface because of the receding of the liquid film can sustain a higher dry-out heat flux, or CHF.

Interfacial Thermal Conductance and Thermal Accommodation Coefficient of Evaporating Thin Liquid Films: A Molecular Dynamics Study

Molecular Dynamics Study On Interface Properties And Interphase Transport

A Molecular Dynamics Investigation on Evaporation of Thin Liquid Films

MOLECULAR DYNAMICS STUDY ON THE DYNAMIC BEHABIORS AND THERMO- DYNAMIC PROPERTIES OF THE LIQUID-VAPOR INTERFACE

Molecular dynamics simulations of the liquid film evaporation heat transfer on different wettability hybrid surfaces at the nanoscale

Molecular Dynamics Simulations of Thermal Transport at the Nanoscale Solid-Liquid Interface

Molecular Dynamics Study of Binary Nanodroplet Evaporation on a Heated Homogeneous Substrate

Evaporation of Lennard-Jones Fluids

A Molecular Dynamics Simulation on the Relationship Between Contact Angle and Solid-Liquid Interfacial Thermal Resistance

Enhanced heat transfer of liquid film evaporation via subdividable patterned surfaces

Molecular Dynamics Simulation of Interfacial Heat Transfer Characteristics of CO2, R32 and CO2/R32 Binary Zeotropic Mixture on a Smooth Substrate

Molecular Dynamics Investigation Of The Slip Flow Liquid-Solid Interfacial Thermal Conductance

Prediction of Thin Liquid Film Evaporation Characteristics with a Thermal Lattice Boltzmann Method

Thermal Transport Through Solid-Liquid Interface: Effect of the Interfacial Coupling and Nanostructured Surfaces

Evaporation Heat Transfer in Thin-Film Region with Bulk Vapor Flow Effect

Molecular Dynamics Simulation of Heat Transport Through Solid-Liquid Interface During Argon Droplet Evaporation on Heated Substrates.

A molecular study on the liquid-vapor interphase transport

Simulation of Liquid Thin Film Evaporation and Boiling on a Heated Hydrophilic Microstructured Surface by Lattice Boltzmann Method

Many-body dissipative particle dynamics with energy conservation: temperature-dependent long-term attractive interaction

Mesoscopic Model for Disjoining Pressure Effects in Nanoscale Thin Liquid Films and Evaporating Extended Meniscuses.

Near-Wall Liquid Layering, Velocity Slip, and Solid–Liquid Interfacial Thermal Resistance for Thin-Film Evaporation in Microchannels