Abstract:Quasi-in-situ method was carried out to observe the growth behavior of intermetallic compounds (IMCs) in Cu/Sn-3.0Ag-0.5Cu/Cu micro solder joints with single β-Sn grain during aging with and without temperature gradient (TG). The bilayer IMCs of Cu6Sn5 + Cu3Sn showed symmetrical growth at both interfaces without TG, proving that β-Sn grain orientation had no effect on interfacial IMC growth during isothermal aging. Many Kirkendall voids were detected due to the dominated growth of Cu3Sn. However, during aging under TG, the IMCs in the joints with different β-Sn grain orientations showed quite different growth behavior and Cu6Sn5 was always the dominant IMC phase with little Cu3Sn and no Kirkendall voids formation. In the joints with small or medium θ angle β-Sn grains, remarkably asymmetrical IMC growth with thick Cu6Sn5 at the cold end and thin discontinuous Cu6Sn5 at the hot end was clarified. Meanwhile, the cold end Cu6Sn5 in medium θ angle joints also presented step-like morphology. The diffusion anisotropy of Cu atoms in β-Sn was responsible for the asymmetrical growth and step-like morphology. In the joints with large θ angle β-Sn grains, the Cu6Sn5 presented similar symmetrical growth to the isothermal aging cases. The different mechanisms of inhibiting Cu3Sn and Kirkendall voids formation at the cold and hot ends were revealed based on TG-induced Cu flux. Finally, a method was proposed to predict the IMC morphology and thickness considering β-Sn grain orientation, which could be helpful for reliability assessment and may also be suitable for IMC growth analysis under current stressing.

Solid state diffusion between Sn and Cu microcones on Cu microcones

Study of Diffusion Mechanism in Low-Temperature Bonding Method Based on Surface Cu Microcones

Low Temperature Bonding Method Using Cu Micro Cones

Investigation on Solid State Bonding and Intermetallic Compounds Reaction of Cu Pillar Bump/ni Micro Cones

Experimental and computational investigation of low temperature Cu-Sn solid-state-diffusion bonding for 3D integration

Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection

Insight into the influence of Cu6Sn5/Cu micro-interface configuration on growth behavior of Cu-Sn interfacial intermetallic compounds in Sn/Cu solder joint

Solid-state Bonding Using Metallic Cone Layer for Interconnection

Effect of Sn Surface Diffusion on Growth Behaviors of Intermetallic Compounds in Cu/ni/snag Microbumps

Low-temperature Solid State Bonding Method Based on Surface Cu–Ni Alloying Microcones

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

Study on Low-Temperature Bonding and Reliability of Nano-Twin Copper Micro-Cone Array

Diffusion anisotropy induced uneven regional growth of Cu6Sn5 IMC in Cu/SAC305/Cu micro solder joints under temperature gradient

Effects of Cu Orientation and Stand-Off-Height on the Microstructure of Cu/Snagcu Interface

Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate

Phase Transformation and Grain Orientation of Cu–Sn Intermetallic Compounds During Low Temperature Bonding Process

Growth Kinetics of Cu6Sn5 Intermetallic Compound in Cu-liquid Sn Interfacial Reaction Enhanced by Electric Current

Enhanced reliability of Cu-Sn bonding through the microstructure evolution of nanotwinned copper

A low-temperature solid-state bonding method using Ag-modified Cu microcones and Ag buffer

Growth Mechanism of Intermetallic Compound in SnAg/Cu Interface of Micro-Bumps under Extremely Low-Temperature by Phase Field Method

Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding